2005
DOI: 10.1117/1.1862648
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Status and issues of electron projection lithography

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Cited by 8 publications
(4 citation statements)
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“…[16] Given the low exposed area, multie-beams or electron-projection-lithography may also be considered. [17] The Metal-1 layer requires double patterning at 22nm because of the 70nm pitch. The line pattern can be created by techniques like SADP which allows patterning at twice the final pitch, then using sidewall spaces to double the spatial frequency.…”
Section: Simulation Results For 22nm Logicmentioning
confidence: 99%
“…[16] Given the low exposed area, multie-beams or electron-projection-lithography may also be considered. [17] The Metal-1 layer requires double patterning at 22nm because of the 70nm pitch. The line pattern can be created by techniques like SADP which allows patterning at twice the final pitch, then using sidewall spaces to double the spatial frequency.…”
Section: Simulation Results For 22nm Logicmentioning
confidence: 99%
“…58,73 Projection electron lithography methods may address this issue. 74 Another challenge is that multiple proteins would be difficult and time consuming due to alignment issues and the required vacuum chamber. However, the above mentioned approach of etching different sized features and incubating with smaller and smaller nanoparticles was reported as one potential way to array multiple proteins.…”
Section: Electron Beam Lithographymentioning
confidence: 99%
“…Generally, in conventional lithography, patterns of the photosensitive material receive strong mechanical force during drying of rinse liquid, then the patterns become unstable, and finally collapse or are distorted as the aspect ratio of pillar height to pitch increases. [8][9][10] The capillary force due to the surface tension of the rinse solvent has potential to make new patterns of photosensitive materials.…”
Section: Introductionmentioning
confidence: 99%