Statistics of Tins and Cans

Ryan, John R.

doi:10.2307/2980837

Cited by 3 publications

(3 citation statements)

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“…The scarcity mentality drove industries into a more diligent search for technologies to reduce the amount of tin in tinplating, and substitutes for the metal. From the late 1940s, the electrolytic tinplate process was introduced to reduce tin content in tinplating by 70% and created a more even layer of tin in cans, as it no longer required dipping thin steel sheets in a tin bath (Ryan, 1952). In 1946, one-third of US-manufactured tinplate were made using the electrolytic process.…”

Section: From Craft To Industrymentioning

confidence: 99%

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From craft to industry and back: transnational efforts in reconstructing tin’s social meaning to the retail consumer (1950s–1960s)

Yong

2023

JHRM

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Purpose Commodity histories generally posit colonies’ roles as mere producers but have overlooked their roles in shaping global consumption. This study aims to investigate how Malayan tin producers and British colonial institutions used public relations and advertising strategies as entrepreneurial tools to fend off competition from substitutes amid global economic and geopolitical transitions during the height of the Cold War crisis and post-war boom in the 1950s and 1960s. Design/methodology/approach This study draws on archival research of newspaper reports written in Singapore, the USA and Britain from the inter-war years until the 1960s. It also consults advertisements placed by the Malayan Tin Bureau on Time and Scientific American, data and views on tin scarcity by US congressional reports and commodity trends data published by the US Department of Commerce and the US Department of the Interior. Findings This paper demonstrates how the value of tin is recreated by manipulating its symbolic meanings and embedding them within the national and political contexts of the targeted consumer markets. This creative resistance against tin substitution was enacted through a transnational collaboration among colonial institutions, entrepreneurs in colonies and marketing strategists across geographies and territories. Research implications This paper provokes further reflections on the importance of socially constructed meanings in shaping the market value of a product and the understanding of embedded political value systems in marketing generic commodities. Future research may adopt this perspective to reassess the framing of meanings of commodities in the contemporary setting, especially against rising concerns on the sustainability of mining natural resources, including minerals. Originality This study integrates the perspectives of Malayan tin producers in reframing the meaning of a commodity and so, widens the scope of historical analyses of commodities beyond the industrialized global North. It reassesses how a commodity’s marketing value evolves and interacts with colonial politics. It also highlights the collaborative nature of colonial governments and local producers in developing new uses and representations of a generic commodity to create new markets for its consumption.

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Section: From Craft To Industrymentioning

confidence: 99%

“…In 1946, one-third of US-manufactured tinplate were made using the electrolytic process. It rapidly grew to more than half of US tinplate production by 1948, and 63.8% in 1951 (Ryan, 1952).…”

Section: From Craft To Industrymentioning

confidence: 99%

From craft to industry and back: transnational efforts in reconstructing tin’s social meaning to the retail consumer (1950s–1960s)

Yong

2023

JHRM

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“…The electroplating of Sn-based finish is a key technology for microelectronic packaging devices (Tan, 1993;Coombs, 2001). Historically, tin plating was used mainly in the canning industries for food packaging (Ryan, 1952). Pure tin metal is environmentally safe, non-toxic, corrosion-resistant and can be applied to electronic substrates for protection as a lead-free alternative (Puttiltz and Stalter, 2004;Suganuma, 2004).…”

Section: Introductionmentioning

confidence: 99%

Pulse plated Sn-Cu solder coatings from stannate bath

Sharma

Ahn

2019

SSMT

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Purpose The purpose of this paper is to investigate the influence of pulse plating current density on the morphology and solderability of Pb-free Sn-Cu solder coatings prepared from alkaline stannate baths. Design/methodology/approach Sn-Cu solder coatings were produced from a plating solution containing sodium stannate, copper stannate, sodium hydroxide and sorbitol additive on copper substrates. The pulse plating experiments were conducted in galvanostatic mode. The plating current density was varied from 5 to 25 mA/cm2, and the morphology of the coatings was studied. The solderability of the coatings was assessed by spread ratio measurement after reflowing the solder coatings at 250°C. Findings The composition control of eutectic solders is always a challenge in plating. The findings show that Sn-Cu coatings prepared by pulse plating are composed of tetragonal ß-Sn structure and Cu6Sn5 compounds irrespective of bath composition and conditions. The final coatings were very dense and smooth with nodular morphology. It was shown that a eutectic composition can be achieved if we apply a current density of ∼15-20 mA/cm2. The solderability studies suggest that solder coatings plated at and beyond 15 mA/cm2 are more suitable for solder finish applications. Originality/value The work presents key issues in pulse electroplating of Sn-Cu solder coatings from an alkaline bath. Possible strategies to control the eutectic Sn-Cu composition by plating process are recommended.

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Effect of current density and alkaline pH on morphology and properties of electroplated Sn

Sharma¹,

Ahn

2020

Mater. Res. Express

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Statistics of Tins and Cans

Cited by 3 publications

References 0 publications

From craft to industry and back: transnational efforts in reconstructing tin’s social meaning to the retail consumer (1950s–1960s)

From craft to industry and back: transnational efforts in reconstructing tin’s social meaning to the retail consumer (1950s–1960s)

Pulse plated Sn-Cu solder coatings from stannate bath

Effect of current density and alkaline pH on morphology and properties of electroplated Sn

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