2007 IEEE International Test Conference 2007
DOI: 10.1109/test.2007.4437700
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Statistical test: A new paradigm to improve test effectiveness & efficiency

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Cited by 17 publications
(16 citation statements)
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“…The imperfect manufacturing test process leads to both test escapes (i.e., bad chips pass the test) and false rejects (i.e., good chips fail the test, also known as test overkill), which is related to the effectiveness of the test decision criterion µ [27]. Generally speaking, the more patterns applied to the circuits (for higher defect coverage), the more false rejects occur, and the steepness is described by parameter ν.…”
Section: ) Test-related Parametersmentioning
confidence: 99%
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“…The imperfect manufacturing test process leads to both test escapes (i.e., bad chips pass the test) and false rejects (i.e., good chips fail the test, also known as test overkill), which is related to the effectiveness of the test decision criterion µ [27]. Generally speaking, the more patterns applied to the circuits (for higher defect coverage), the more false rejects occur, and the steepness is described by parameter ν.…”
Section: ) Test-related Parametersmentioning
confidence: 99%
“…a) The effectiveness of the test decision criterion µ. b) The parameter v that sets the steepness of the fallout curve that shows the probability for defects to be detected when test patterns are gradually applied [27]. c) The product quality requirement for the maximum test escape percentage τ (e.g., τ = 0.0005 for 500 DPPM).…”
Section: ) Test-related Parametersmentioning
confidence: 99%
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