Stadtgespräche
DOI: 10.1007/978-3-531-91122-9_2
|View full text |Cite
|
Sign up to set email alerts
|

Stadtgespräch mit Hans Paul Bahrdt

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

0
5
0
3

Publication Types

Select...
6

Relationship

0
6

Authors

Journals

citations
Cited by 9 publications
(9 citation statements)
references
References 0 publications
0
5
0
3
Order By: Relevance
“…By cooling the multilayer and a reduction of the pinhole size the heat load capability of the detector, which is mainly determined by the multilayer, should be sufficient to permit a characterization of the helical insertion device UE56 being designed for BESSY II, where its third harmonic will cover the energy range of the current assembly. 16 …”
Section: Discussionmentioning
confidence: 97%
“…By cooling the multilayer and a reduction of the pinhole size the heat load capability of the detector, which is mainly determined by the multilayer, should be sufficient to permit a characterization of the helical insertion device UE56 being designed for BESSY II, where its third harmonic will cover the energy range of the current assembly. 16 …”
Section: Discussionmentioning
confidence: 97%
“…12 Wissenschaftliche Publikationen der 1950er und frühen 1960er Jahre, die das Wort ,,interdisziplinär'' verwendeten, thematisierten so zum einen Formen der Wissenschaftsorganisation in den Vereinigten Staaten. 13 Zudem erschien das Adjektiv in der Auseinandersetzung mit amerikanischen Forschungsarbeiten und Tagungen. 14 Insbesondere deutschsprachige Rezensionen englischsprachiger Veröffentlichungen griffen das Adjektiv ,,interdisciplinary'' direkt aus den besprochenen Texten auf, übersetzten es und transferierten es so in die deutsche Sprache.…”
unclassified
“…Magnetization measurements of each undulator magnet taken before assembly and a subsequent matching of neighbor magnets in the undulator together with sub micrometer processing accuracy, lead to a relative rms field error of the assembled device below 1.75% corresponding to a phase error below 3.7°both measured at 15 K [16]. The specifications measured by an in vacuum Hallprobe bench are listed in Table I.…”
Section: Undulator Specificationsmentioning
confidence: 99%