2016
DOI: 10.4028/www.scientific.net/msf.858.147
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Stacking Fault Analysis of Epitaxial 3C-SiC on Si(001) Ridges

Abstract: The stacking faults (SFs) in 3C-SiC epitaxially grown on ridges deeply etched into Si (001) substrates offcut towards [110] were quantitatively analyzed by electron microscopy and X-ray diffraction. A significant reduction of SF density with respect to planar material was observed for the {111} planes parallel to the ridges. The highest SF density was found in the (-1-11) plane. A previously observed defect was identified as twins by electron backscatter diffraction.

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Cited by 11 publications
(8 citation statements)
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“…The out-of-equilibrium method of growth, low-energy plasmaenhanced chemical vapour deposition (LEPECVD) (Rosenblad et al, 1998), results in a dense network of micrometresized three-dimensional epitaxial crystals. The use of deeply patterned substrates, along with growth by LEPECVD, initially demonstrated for the growth of Ge on Si(001) (Falub et al, 2013;Isa, Pezzoli et al, 2015;Rozbořil et al, 2016), was further extended to other materials and growth techniques, such as GaAs growth by metal-organic vapour phase epitaxy (Bietti et al, 2013;Falub et al, 2014;Taboada et al, 2014Taboada et al, , 2016, GaN growth by plasma-assisted molecular beam epitaxy (Isa, Chè ze et al, 2015) and SiC growth by chemical vapour deposition Meduň a, Kreiliger et al, 2016). The basic principle behind the approach is that dislocations are confined close to the heterointerface, while the bulk of the crystal remains dislocation free (Marzegalli et al, 2013;Falub et al, 2013;Isa et al, 2013).…”
Section: Introductionmentioning
confidence: 99%
“…The out-of-equilibrium method of growth, low-energy plasmaenhanced chemical vapour deposition (LEPECVD) (Rosenblad et al, 1998), results in a dense network of micrometresized three-dimensional epitaxial crystals. The use of deeply patterned substrates, along with growth by LEPECVD, initially demonstrated for the growth of Ge on Si(001) (Falub et al, 2013;Isa, Pezzoli et al, 2015;Rozbořil et al, 2016), was further extended to other materials and growth techniques, such as GaAs growth by metal-organic vapour phase epitaxy (Bietti et al, 2013;Falub et al, 2014;Taboada et al, 2014Taboada et al, , 2016, GaN growth by plasma-assisted molecular beam epitaxy (Isa, Chè ze et al, 2015) and SiC growth by chemical vapour deposition Meduň a, Kreiliger et al, 2016). The basic principle behind the approach is that dislocations are confined close to the heterointerface, while the bulk of the crystal remains dislocation free (Marzegalli et al, 2013;Falub et al, 2013;Isa et al, 2013).…”
Section: Introductionmentioning
confidence: 99%
“…Specific patterning of Si substrate has been proposed in order to further decrease the amount of extended defects. [9][10][11][12][13] Lower SF densities are observed at the surface of 3C-SiC layers grown on undulate, [14] pyramidal-shape, [15,16] and pillar-shape patterned substrates. [9,10] At this, however, the desired defect level for device performance (10 2 cm −1 ) has not been reached so far.…”
Section: Introductionmentioning
confidence: 99%
“…[9][10][11][12][13] Lower SF densities are observed at the surface of 3C-SiC layers grown on undulate, [14] pyramidal-shape, [15,16] and pillar-shape patterned substrates. [9,10] At this, however, the desired defect level for device performance (10 2 cm −1 ) has not been reached so far. [17][18][19] The effectiveness of growing techniques and their optimization strictly depend on the understanding of the evolution mechanisms of SFs and terminating them partial dislocations during deposition.…”
Section: Introductionmentioning
confidence: 99%
“…The method has been successfully applied to several heteroepitaxial systems such as Ge/Si [11,12,13], GaAs/Si [14,15], GaAs/Ge/Si [16] and GaN/Si [17]. It has already been demonstrated also for 3C-SiC/Si in References [9,18], with beneficial effects on the crystal quality [18] and a substantial decrease in defectivity [19,20].…”
Section: Introductionmentioning
confidence: 99%