Abstract:Since the last 2-4 years, the focus in microelectronics is gradually changing from front-end to packaging. More added values are put into packages, where System in Packages (SiP) is an answer for the ongoing function integration trend. In SiP several dies are placed into one package, either side-by-side or on top of each other. The miniaturization trend more or less forbids placing dies side-by-side, since it will make the package larger. Several stacking die concepts exist, in this paper we have investigated … Show more
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