Stacked Integration of MEMS on LSI

Esashi, Masayoshi; Tanaka, Shuji

doi:10.3390/mi7080137

Cited by 18 publications

(11 citation statements)

References 20 publications

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“…Ordinary monolithic integration of a MEMS and CMOS (Complementary Metal Oxide Semiconductor) device involves the migration of a manufacturing process which causes restriction on performance, cost and development speed. On the other hand, the MEMS-CMOS integration using wafer bonding of separately manufactured wafers allows for using ASIC wafers produced by the latest CMOS process to be integrated with a MEMS wafer optimized and manufactured independently [ 7 , 8 , 9 ].…”

Section: Design Of Tactile Sensormentioning

confidence: 99%

Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin

Makihata

Muroyama

Tanaka

et al. 2018

Sensors

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Covering a whole surface of a robot with tiny sensors which can measure local pressure and transmit the data through a network is an ideal solution to give an artificial skin to robots to improve a capability of action and safety. The crucial technological barrier is to package force sensor and communication function in a small volume. In this paper, we propose the novel device structure based on a wafer bonding technology to integrate and package capacitive force sensor using silicon diaphragm and an integrated circuit separately manufactured. Unique fabrication processes are developed, such as the feed-through forming using a dicing process, a planarization of the Benzocyclobutene (BCB) polymer filled in the feed-through and a wafer bonding to stack silicon diaphragm onto ASIC (application specific integrated circuit) wafer. The ASIC used in this paper has a capacitance measurement circuit and a digital communication interface mimicking a tactile receptor of a human. We successfully integrated the force sensor and the ASIC into a 2.5×2.5×0.3 mm die and confirmed autonomously transmitted packets which contain digital sensing data with the linear force sensitivity of 57,640 Hz/N and 10 mN of data fluctuation. A small stray capacitance of 1.33 pF is achieved by use of 10 μm thick BCB isolation layer and this minimum package structure.

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Section: Design Of Tactile Sensormentioning

confidence: 99%

Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin

Makihata

Muroyama

Tanaka

et al. 2018

Sensors

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“…The heterogeneous integration of MEMS on LSI has been achieved by stacking MEMS on LSI. (14) This enables advanced microsystems. It is important not to damage the LSI.…”

Section: Heterogeneous Integrationmentioning

confidence: 99%

Wafer-level Packaging, Equipment Made in House, and Heterogeneous Integration

2018

Sensors and Materials

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Micro-electromechanical systems (MEMS) have been developed for sensors and other systems since 1971 at Tohoku University. Ion-sensitive FET (ISFET) probes made by micromachining were commercialized for pH and PCO 2 catheters. Special attention was paid to packaging and wafer-level packaging based on glass-to-Si anodic bonding was applied for integrated capacitive pressure sensors, capacitive diaphragm vacuum gauges, MEMS switches, and other devices. Process equipment for not only MEMS but also integrated circuits (ICs) has been made in house because it is important for flexible prototyping and fabrication of novel devices. Equipment for deep reactive ion etching (RIE) of Si was developed and applied for an electrostatically levitated rotational gyroscope and other devices. Heterogeneous integration as MEMS on LSI has been made possible by the transfer of MEMS on a carrier wafer to an LSI wafer or by stacking a MEMS wafer on an LSI wafer using electrical interconnection with a through Si via (TSV). A piezoelectric MEMS switch on an LSI chip, surface acoustic wave (SAW) filters on an LSI chip, a tactile sensor network, and an active matrix electron emitter array are shown as examples of these technologies.

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“…Exploration of the resonator’s lumped element equivalent model had been reported for the circuit design [ 26 , 27 ]. An oscillator circuit with FBARs had been fabricated with different structures [ 13 , 28 , 29 ]. Furthermore, the performance of the integrated sensor will be affected by its circuit section.…”

Section: Introductionmentioning

confidence: 99%

A Sensitivity-Enhanced Film Bulk Acoustic Resonator Gas Sensor with an Oscillator Circuit and Its Detection Application

Zhang

Fang

et al. 2017

Micromachines

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This paper presents a sensitivity-enhanced gas sensor based on a film bulk acoustic resonator (FBAR). It was designed and fabricated with micro through-holes in its top electrode for sensitivity enhancement. The sensor was driven by a Colpitts oscillator circuit, and the output signal had characteristics of a power of −2.6 dBm@3 V and a phase noise of −90 dBc/Hz@100 kHz. In order to test the performance of the sensor, it was used for the detection of relative humidity (RH) and ethanol. When the relative humidity ranged from 25% to 88%, the frequency shift of the sensor was 733 kHz, which was 3.2 times higher than that of the existing FBAR sensor with a complete top electrode. Fitting results of the frequency shift and the relative humidity indicated that the measurement error was within ±0.8% RH. When the ethanol concentration ranged from 0 to 0.2355 g/L, the frequency shift of the sensor was 365 kHz. The effect of the oscillator circuit on the adsorption reaction and temperature response of the FBAR sensor device was analyzed to optimize its detection application.

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Stacked Integration of MEMS on LSI

Cited by 18 publications

References 20 publications

Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin

Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin

Wafer-level Packaging, Equipment Made in House, and Heterogeneous Integration

A Sensitivity-Enhanced Film Bulk Acoustic Resonator Gas Sensor with an Oscillator Circuit and Its Detection Application

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