Extreme
ultraviolet (EUV) lithography currently dominates the frontier
of semiconductor fabrication. Photoresists must satisfy increasingly
strict pattern fidelity requirements to realize the significant enhancements
in resolution offered by EUV technology. Traditional chemically amplified
resists (CARs) have hit a barrier in the form of the resolution, line
edge roughness, and sensitivity trade-off. This has been compounded
by a lack of understanding of the chemical mechanism associated with
the EUV process. Here, we synthesize a series of novel EUV photoresists
based on a self-immolative, acid-labile poly(acetal) system. These
systems are shown to be commercially viable under current EUV requirements.
Careful study of the resists’ degradation pathways has enabled
the identification of a remarkable photoacid generator (PAG) that
functions as both an acid generator and base quencher, enabling further
improvements over previous resists. density functional theory calculations
reveal, for the first time, the connection between the PAG activation
barrier and resist sensitivity and suggests why attempts to use electron-beam
lithography to predict EUV performance have failed.