Stability of conductor metallizations in corrosive environments

English, A. T.; Turner, P. A.

doi:10.1007/bf02660350

Cited by 28 publications

(17 citation statements)

References 2 publications

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“…While the gold/chromium system is relatively immune to corrosion in normal atmospheres, this is not the case when even trace amounts of halogens are present (4,5,11,12). Furthermore, chromium is very mobile in the grain boundaries of gold.…”

Section: In Part After 12)mentioning

confidence: 99%

Gold/chromium metallizations for electronic devices

Holloway

1979

Gold Bull

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Three main criteria are applied in the selection of metallization systems used in electronic devices. Firstly, these systems must have good conductivity to minimize power losses. Gold, with a resistivity of 2.4 mn xcm, fulfils this condition and can tolerate high current densities. Secondly, metallizations must be inert or remain passive in operating environments if a high level of reliability is to be achieved. In this latter respect, gold is unequalled as an outer,layer for metallizations because it does not form corrosion products in severe environments. Thirdly, metallization systems should be compatible with manufacturing processes. Anderson (1) and Mattox (2) have reviewed some of these processes and their operating parameters. Thin film systems can be categorized according to whether one, two, three or four cornponents are used (Table I) and, in general, it is desirable to use the least number of metals in order to simplify their preparation. Thus, the one-component system of aluminium has been used extensively and with great success in applications where corrosion resistance is not critical.Apart from meeting the first two criteria listed above, gold is also compatible with beam-leaded and lead frame inter-and intraconnection technologies, it has substantial resistance to electromigration and can readily be deposited in thin layers by a variety of wet or vacuum processes. However, although Mattox (2) lists gold as a one-component metallization, it is not frequently used as such because it does not adhere well to oxide (or oxidized) surfaces (1,3). One or more metals are normally used at the gold-substrate interface to ensure strong bonding. Of the two-component systems listed in Table I, gold/chromiumm?is the most resistant to atmospheric corrosion (4 to 8) and its resistivity is generally lower than that of goldpalladium/chromium because of alloying effects between gold and palladium (7). The presence of palladium or platinum as x in three-component systems of the gold/x/titanium type improves the corrosion resistance over that of gold/chromium (4), but also increases the metallization resistivity because of interdiffusion between gold and palladium or=.:•=• platinum (9,10). Unalloyed palladium is not as inert Au/Mo/Ti *The sequence of the components is from the free surface towerds the substrate, the sequence of deposition during manufacture is therefore the reverse of that indicated here. 99

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Section: In Part After 12)mentioning

confidence: 99%

Gold/chromium metallizations for electronic devices

Holloway

1979

Gold Bull

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“…(From reference 70, Copyright: The Institute of Physics, England.) Scratch test has been employed by many workers in studying the adhesion of an assortment of films.S3, [71][72][73][74][75] It is important to point out that Chopra 69 found that the critical load (in the case of polycrystalline Au films deposited on glass) increased nearly linearly with film thickness above 200 nm, which suggests that the critcial load is determined both by the adhesion at the interface and the mechanical strength of the film. Hamersky72, in his studies of adhesion of aluminum films deposited on glass slides, concluded that the the accuracy of the scratch test result is dependent on the point radius and only indirectly on its hardness.…”

Section: Scratch or Stylus Or Scribe Methodsmentioning

confidence: 99%

Adhesion Measurement of Thin Films

Mittal¹

1976

Active and Passive Electronic Components

336

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“…factors such as the size and surface finish of the stylus as well as the thickness of the film can determine Scratch test has been employed by many workers in studying the adhesion of an assortment of films.S3, [71][72][73][74][75] It is important to point out that Chopra 69 found that the critical load (in the case of polycrystalline Au films deposited on glass) increased nearly linearly with film thickness above 200 nm, which suggests that the critcial load is determined both by the adhesion at the interface and the mechanical strength of the film. Hamersky72, in his studies of adhesion of aluminum films deposited on glass slides, concluded that the the accuracy of the scratch test result is dependent on the point radius and only indirectly on its hardness.…”

Section: Mechanical Methodsmentioning

confidence: 99%

Adhesion measurement of thin films

1976

Microelectronics Reliability

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Stability of conductor metallizations in corrosive environments

Cited by 28 publications

References 2 publications

Gold/chromium metallizations for electronic devices

Gold/chromium metallizations for electronic devices

Adhesion Measurement of Thin Films

Adhesion measurement of thin films

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