Stability in thin film multilayers and microlaminates: the role of free energy, structure, and orientation at interfaces and grain boundaries

Lewis, A. C.; Josell, Daniel; Weihs, Timothy P.

doi:10.1016/s1359-6462(02)00629-2

Cited by 92 publications

(45 citation statements)

References 21 publications

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“…Broadly speaking, there are three main thermodynamic driving forces that can affect layering stability at high temperatures: energy of mixing between the layer materials, elastic strain energy, and relative interfacial to grain boundary free energies [4][5][6][7][8][9][10]. Generally, the free energy of the multilayer can be reduced through interdiffusion between layers or morphological evolution to non-planar or discontinuous interfaces.…”

Section: Introductionmentioning

confidence: 99%

“…The main contribution to the elastic stresses in MLCCs arises from the mismatch of densification rates between the ceramic layers and metal electrodes during co-sintering [7,8]. Local variations in elastic stress take place when perturbations in layer thickness appear [7], which are unavoidable in polycrystalline systems such as MLCCs. Such stress gradients drive mass transport from the thinnest areas, where stresses are highest, to the thickest parts of the same layer, where stresses are lowest.…”

Section: Introductionmentioning

confidence: 99%

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Effect of Cr additions on the microstructural stability of Ni electrodes in ultra-thin BaTiO3 multilayer capacitors

et al. 2007

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Microstructural control in thin-layer multilayer ceramic capacitors (MLCC) is one of the present day challenges to maintain an increase in capacitive volumetric efficiency. This present paper opens a series of investigations aimed to engineer the stability of ultra-thin Ni electrodes in BaTiO 3 -based multilayer capacitors using refractory metal additions to Ni. Here, pure Ni and Ni-1 wt.% Cr alloy powders are used to produce 0805-type BME MLCCs with 300 active layers and with dielectric and electrode layer thickness around 1 μm. To investigate the continuity of Ni electrodes, both MLCC chips with pure and doped electrodes were sintered at different temperatures for 5 h. It is found that the continuity of Ni electrodes is improved most likely due to the effect of Cr on the lowmelting point (Ni,Ba,Ti) interfacial alloy layer formation. The interfacial alloy layer is not observed when Cr is segregated at Ni-BaTiO 3 interface in the Cr-doped samples, while it is found in all undoped samples. The interfacial alloy layer is believed to increase mass-transfer along the Ni-BaTiO 3 interfaces facilitating an acceleration of Ni electrodes discontinuities.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effect of Cr additions on the microstructural stability of Ni electrodes in ultra-thin BaTiO3 multilayer capacitors

et al. 2007

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“…These results suggest that irradiation temperature plays a crucial role in layer stability. In general, layer stability depends on the ratio of average grain size to layer thickness (d/h) [31,32]. The critical d/h value is determined by grain-boundary energies and interface energies between components.…”

Section: Analysis Of Microstructure Before and After Irradiationmentioning

confidence: 99%

Temperature-Dependent Helium Ion-Beam Mixing in an Amorphous SiOC/Crystalline Fe Composite

Price

Shao

et al. 2016

Metals

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Abstract:Temperature dependent He-irradiation-induced ion-beam mixing between amorphous silicon oxycarbide (SiOC) and crystalline Fe was examined with a transmission electron microscope (TEM) and via Rutherford backscattering spectrometry (RBS). The Fe marker layer (7.2 ± 0.8 nm) was placed in between two amorphous SiOC layers (200 nm). The amount of ion-beam mixing after 298, 473, 673, 873, and 1073 K irradiation was investigated. Both TEM and RBS results showed no ion-beam mixing between Fe and SiOC after 473 and 673 K irradiation and a very trivial amount of ion-beam mixing (~2 nm) after 298 K irradiation. At irradiation temperatures higher than 873 K, the Fe marker layer broke down and RBS could no longer be used to quantitatively examine the amount of ion mixing. The results indicate that the Fe/SiOC nanocomposite is thermally stable and tends to demix in the temperature range from 473 to 673 K. For application of this composite structure at temperatures of 873 K or higher, layer stability is a key consideration.

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“…Similarly, fine-grained systems can be subject to grain growth during testing. Without a stable microstructure, clear identification of deformation mechanisms is very challenging [13][14].…”

Section: High Temperature Properties Of Nb/nbssia Microlaminatesmentioning

confidence: 99%

“…This suggests that bulk diffiision is controlling the diffiasional creep, not grain boundary diffusion as one might expect for this fine grain size. However, diffiision in fine-grained samples is not well understood and little data exists [12][13][14]. Additional studies are needed.…”

Section: High Temperature Properties Of Nb/nbssia Microlaminatesmentioning

confidence: 99%

Processing and High Temperature Properties of Nb/Nb5Si3 Laminates

Weihs¹,

VanHeerden²

2004

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Stability in thin film multilayers and microlaminates: the role of free energy, structure, and orientation at interfaces and grain boundaries

Cited by 92 publications

References 21 publications

Effect of Cr additions on the microstructural stability of Ni electrodes in ultra-thin BaTiO3 multilayer capacitors

Effect of Cr additions on the microstructural stability of Ni electrodes in ultra-thin BaTiO3 multilayer capacitors

Temperature-Dependent Helium Ion-Beam Mixing in an Amorphous SiOC/Crystalline Fe Composite

Processing and High Temperature Properties of Nb/Nb5Si3 Laminates

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