Sputtering yields of PMMA films bombarded by keV C60+ ions

Bolotin, Igor L.; Tetzler, Stephanie H.; Hanley, Luke

doi:10.1016/j.apsusc.2006.02.080

Cited by 12 publications

(21 citation statements)

References 25 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…It has been repeatedly demonstrated, that increasing cluster beam energies generally results in increases in sputter and secondary ion yields in organic and polymeric samples (Wagner, 2004;Bolotin, Tetzler, & Hanley, 2006;Fletcher et al, 2006a;Shard et al, 2007). A nice example is shown below in a plot taken from Shard et al (2007), which shows the sputtering yield volumes for PLA, Irganox 1010 and Alq 3 samples as a function of C þ 60 beam energy (see Fig.…”

Section: Beam Energymentioning

confidence: 91%

Cluster secondary ion mass spectrometry of polymers and related materials

Mahoney

2009

Mass Spectrometry Reviews

283

329

View full text Add to dashboard Cite

Cluster secondary ion mass spectrometry (cluster SIMS) has played a critical role in the characterization of polymeric materials over the last decade, allowing for the ability to obtain spatially resolved surface and in-depth molecular information from many polymer systems. With the advent of new molecular sources such as C(60)(+), Au(3)(+), SF(5)(+), and Bi(3)(+), there are considerable increases in secondary ion signal as compared to more conventional atomic beams (Ar(+), Cs(+), or Ga(+)). In addition, compositional depth profiling in organic and polymeric systems is now feasible, without the rapid signal decay that is typically observed under atomic bombardment. The premise behind the success of cluster SIMS is that compared to atomic beams, polyatomic beams tend to cause surface-localized damage with rapid sputter removal rates, resulting in a system at equilibrium, where the damage created is rapidly removed before it can accumulate. Though this may be partly true, there are actually much more complex chemistries occurring under polyatomic bombardment of organic and polymeric materials, which need to be considered and discussed to better understand and define the important parameters for successful depth profiling. The following presents a review of the current literature on polymer analysis using cluster beams. This review will focus on the surface and in-depth characterization of polymer samples with cluster sources, but will also discuss the characterization of other relevant organic materials, and basic polymer radiation chemistry.

show abstract

Section: Beam Energymentioning

confidence: 91%

Cluster secondary ion mass spectrometry of polymers and related materials

Mahoney

2009

Mass Spectrometry Reviews

283

329

View full text Add to dashboard Cite

show abstract

“…Here, it has been found that huge sputter yields containing a high fraction of unfragmented molecules can be obtained by cluster impact on molecular targets [7,8]. A vital question for the performance of depth analyses using this technique is the following: To what extent is the irradiated target contaminated with impact debris, i.e., molecular fragments or reaction products-or has this debris been swept out and sputtered away?…”

mentioning

confidence: 99%

Chemical Energy Release and Radical Formation in Cluster-Induced Sputtering of Diatomic Molecular Targets: A Molecular-Dynamics Model Study

Anders

Urbassek

2007

Phys. Rev. Lett.

View full text Add to dashboard Cite

Using molecular-dynamics simulation, we perform a systematic study of cluster-induced sputtering. Two model systems of diatomic molecular solids are employed, which have identical cohesive energy but differ in their dissociation energy and the possible reaction pathways. Sputtering occurs by the flow of gasified material out of the spike volume into the vacuum above it. Because of the entrainment of radicals and reaction products with the flow, only a minority of this debris is left behind in the target. The excitation of internal molecular degrees of freedom (rotation and vibration) slightly reduces the sputter yield in comparison to the sputtering of an atomic system, while the chemical energy release due to exothermic reactions of radicals formed enhances the yield in proportion to the chemical energy release.

show abstract

“…The impact of water cluster ions following-up enhances the ejection of methacrylic acid molecule at the monomer state from the surface. Thus, the high rate sputtering of PMMA surfaces is achieved by both the chemical erosion of the surface and the momentum transfer of the incident energy, which is different from the sputtering of PMMA surfaces reported elsewhere [15][16][17]. Figure 3 shows the dependence of sputtered depth for Si(100) and SiO 2 surfaces on the ion dose.…”

Section: Resultsmentioning

confidence: 99%

Chemical Modification of Solid Surfaces at Nano-level by Water Cluster Ion Irradiation

Takaoka

Ichihashi

Ryuto

et al. 2011

e-J. Surf. Sci. Nanotechnol.

View full text Add to dashboard Cite

We have investigated impact-process of water cluster ions on solid surfaces. Various kinds of substrates such as Si(100), SiO2 and PMMA substrates were irradiated by adjusting the acceleration voltage and the ion dose. The sputtered depth of these substrates increased with increase of the acceleration voltage, and it was 37 nm for Si, 49 nm for SiO2, and 2.9 µm for PMMA substrates, respectively at an acceleration voltage of 9 kV and an ion dose of 1.0×1016 ions/cm 2 . The sputtering yield calculated was 19 atoms per ion for Si and 13 molecules per ion for SiO2, which was approximately ten times larger than that for Ar monomer ion irradiation. The XPS measurement showed that the Si substrate surfaces sputtered at an ion dose of 1.0×1016 ions/cm 2 had an oxide layer such as SiOx. The oxide layer thickness increased with increase of the acceleration voltage, and it was approximately 10 nm at an acceleration voltage of 6 kV. On the other hand, at lower ion doses such as 1.0×1014 ions/cm 2 , the ratio of the sputtered depth of Si surface to SiO2 surface became approximately 10. This indicated that the chemical erosion such as silicon hydride occurred, resulting in enhancement of chemical sputtering of Si substrates. Furthermore, for the case of PMMA substrates, the chemical erosion of the substrate surfaces occurred probably through the exchange between CH3 and H radicals, and the chemical sputtering by the ejection of methacrylic acid molecule was enhanced. The surface roughness of PMMA substrates irradiated was less than 2 nm, and the smooth surface at the nano-level was obtained. In addition, micro-patterning was demonstrated with the water cluster ion beams on the PMMA substrates.

show abstract

Sputtering yields of PMMA films bombarded by keV C60+ ions

Cited by 12 publications

References 25 publications

Cluster secondary ion mass spectrometry of polymers and related materials

Cluster secondary ion mass spectrometry of polymers and related materials

Chemical Energy Release and Radical Formation in Cluster-Induced Sputtering of Diatomic Molecular Targets: A Molecular-Dynamics Model Study

Chemical Modification of Solid Surfaces at Nano-level by Water Cluster Ion Irradiation

Contact Info

Product

Resources

About