Sputtering of Ultra-thin Ag Nano-twinned Films on Si Wafers for the Applications in TSV Interconnection of 3D-IC Advanced Packages Copper Solvent Extraction
Yin-Hsuan Chen,
Zi-Hong Yang,
Yen-Ting Chen
et al.
Abstract:Nanotwinned structure has been attracting a great deal of attention due to their excellent mechanical and electrical properties. In this study, ultra-thin nanotwinned Ag films can be fabricated by DC magnetron sputtering with moderate substrate bias. Within these nanotwinned films, only 100-400 nm thick equiaxed-grin transition layer was formed between the nanotwinned region and Si substrate observed by Focused ion Beam (FIB). For the analysis of nanotwinned films, the as-deposited films are shown to have a st… Show more
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