1979
DOI: 10.1016/0378-5963(79)90024-2
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Sputtering of amorphous silicon films by 0.5 to 5 keV Ar+ ions

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Cited by 69 publications
(17 citation statements)
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“…The agreement is quite good, if not excellent. Slight deviations observed in the large-depth tails at fluences > 2 Â 10 16 cm À2 as well as somewhat more pronounced deviations at the leading edge of the profile for 5 Â 10 15 [19,22] with profiles calculated using the rapid relocation model (solid lines). The limited depth resolution in the simulations was taken into account in the rapid relocation model.…”
Section: Comparison With Sdtrimsp Simulationsmentioning
confidence: 93%
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“…The agreement is quite good, if not excellent. Slight deviations observed in the large-depth tails at fluences > 2 Â 10 16 cm À2 as well as somewhat more pronounced deviations at the leading edge of the profile for 5 Â 10 15 [19,22] with profiles calculated using the rapid relocation model (solid lines). The limited depth resolution in the simulations was taken into account in the rapid relocation model.…”
Section: Comparison With Sdtrimsp Simulationsmentioning
confidence: 93%
“…8 saturation areal densities N 1 of Xe and Ar [23,24] are compared with data obtained by SDTrimSP simulations [19,22] (the increase in the areal density of Ar observed in [24] at fluences exceeding 1 Â 10 16 cm À2 appears to be an extreme case of enhanced retention due to sample oxidation in the employed plasma device; the effect has been explored in detail some time ago [25]). One data point illustrating the strongly reduced retention at oblique incidence is also shown (3 keV Ar @ 51° [15]). Below 100 keV the measured and calculated results for Ar exhibit almost the same energy dependence, with a maximum deviation of about 25%.…”
Section: Energy Dependence Of Inert Gas Retention and Relocation Effimentioning
confidence: 96%
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