Sputter Deposition Processes

Deposition Technologies

“…This makes sputtering a very versatile process. For depositing alloys, the best solution is to use a sinter target with the same composition as the desired film [9]. An alternative approach for creating a two-phase compound is to co-sputter from two sources.…”

“…3.35 and 3.36) or is loaded through a transport module serving as a loadlock. The vacuum chamber walls are stainless or mild steel [9]. The vacuum chamber requires [67], used with permission a pumping capacity for reducing the vacuum pressure to typically 1.3 × 10 -4 Pa (10 −6 Torr) at the start of a deposition run.…”

“…This transformation may be caused by a thermal process resulting in evaporating solid or liquid materials [1,7,8]. Alternatively, it may be based on a plasma process ejecting atoms from a solid target due to a collision impact with excited ions, a process called sputtering [1,9,10]. The atoms travel from the source to their destination, typically a substrate, under vacuum (strictly speaking partial vacuum) conditions to minimize collisions during the transition.…”

Yttria stabilized zirconia buffered silicon: substrates for YBCO microwave applications

“…This current is 90 out of phase with the voltage suggesting that the sheaths are capacitive, the value of which is a function of the voltage at the cathode. Ions are now unable to respond to the rapidly changing electric field and hence are less influenced by the full voltage modulation [92]. Instead, the effect of the self-bias potential described in the previous section, is more pronounced.…”

“…It is important to note that since the average velocity of ions is much less than that of the electrons, they are virtually unaffected by the magnetic field. They are, however, affected by the electron motion through electrostatic attraction that can lead to charge exchange and their neutralization [92].…”