SPS sintering of silicon nitride with fluoride additive

Tatlı, Zafer; Çalışkan, Fatih; Butler, James D.; Crowley, Clare M.; Hampshire, Stuart

doi:10.1016/j.ceramint.2013.07.021

Cited by 37 publications

(15 citation statements)

References 25 publications

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“…It has been reported earlier that the use of uoride additives can decrease the lattice oxygen contents and porosity of the composites. 31,39 The bulk and relative densities of HP sintered GNP/Si 3 N 4 composites with different GNP content are plotted in Fig. 4a.…”

Section: Methodsmentioning

confidence: 99%

Enhanced thermal conductivity and mechanical properties of a GNP reinforced Si₃N₄ composite

et al. 2019

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Section: Methodsmentioning

confidence: 99%

Enhanced thermal conductivity and mechanical properties of a GNP reinforced Si₃N₄ composite

et al. 2019

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“…This second route is what is employed in this work. Concerning sintering process, during the last years, Spark Plasma Sintering (SPS) has emerged as a very promising technology for these materials [15][16][17][18][19][20][21]. This technique allows obtaining high density materials in short processing times leading to microstructure control unattainable by other technologies.…”

Section: Introductionmentioning

confidence: 99%

Spark Plasma Sintered Si₃N₄/TiN Nanocomposites Obtained by a Colloidal Processing Route

Díaz

Solís

Peretyagin

et al. 2016

Journal of Nanomaterials

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Ceramic Si3N4/TiN (22 vol%) nanocomposites have been obtained by Spark Plasma Sintering (SPS). Our colloidal processing route allows obtaining dispersed nanoparticles of TiN smaller than 50 nm avoiding the presence of agglomerates. The nanostructured starting powders were obtained by using a colloidal method where commercial Si3N4submicrometer particles were coated with anatase TiO2nanocrystals. A later nitridation process led to the formation of TiN nanoparticles on the surface of Si3N4. A second set of powders was prepared by doping the above defined powders with yttrium and aluminium precursors using also a colloidal method as sources of alumina and yttria. After thermal nitridation and SPS treatment, it has been found that the addition of oxides dopants improves the mechanical performance (KIC,σf) but increases the electrical resistivity and significantly reduces the hardness. This is due to the formation of a continuous insulating glassy phase that totally envelops the conductive TiN nanoparticles, avoiding the percolative contact between them. The combination of colloidal processing route and SPS allows the designing of tailor-made free glassy phase Si3N4/TiN nanocomposites with controlled microstructure. The microstructural features and the thermoelectrical and mechanical properties of both kinds of dense SPSed compacts are discussed in this work.

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“…The uoride additives help to enhance the phase transformation from a to b-Si 3 N 4 as well as the densication of ceramics. 43,44 Consequently, the uoride additives can better improve the mechanical properties as well as the thermal conductivity of ceramic composites.…”

Section: Densitymentioning

confidence: 99%

Carbon nanostructure-reinforced SiC_w/Si₃N₄ composite with enhanced thermal conductivity and mechanical properties

et al. 2020

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Carbon nanostructures (CNS) as a kind of reinforcement material can remarkably enhance the mechanical and thermal properties of ceramics. This research presents an analysis of the influence of CNS on the thermal conductivity and mechanical properties of SiC w /Si 3 N 4 composites. The SiC w /Si 3 N 4 composites containing various types of CNS e.g. carbon nanofibers (CNF), multi-walled carbon nanotubes (MWCNT) and graphene nano-platelets (GNP) were fabricated by hot-press sintering. XRD analysis confirmed a complete transformation of a-Si 3 N 4 to b-Si 3 N 4 and microstructural analysis shows a uniform distribution, as well as a pullout and bridging mechanism of CNS. The results revealed that the thermal conductivity and mechanical properties of SiC w /Si 3 N 4 composites increased with the addition of CNS. Maximum values of fracture toughness (9.70 AE 0.8 MPa m 1/2 ) and flexural strength (765 AE 58 MPa) have been achieved for the MWCNT-containing SiC w /Si 3 N 4 composite, whereas the maximum values of Young's modulus (250 AE 3.8 GPa) and hardness (27.2 AE 0.9 GPa) have been achieved for the CNFcontaining SiC w /Si 3 N 4 composite. Moreover, thermal conductivity also improved with the addition of CNS and reached a maximum value of 110.6 W m À1 K À1 for the CNF-containing SiC w /Si 3 N 4 composite.This work provides a useful approach for the fabrication of high-performance multifunctional composites for emerging engineering applications.

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SPS sintering of silicon nitride with fluoride additive

Cited by 37 publications

References 25 publications

Enhanced thermal conductivity and mechanical properties of a GNP reinforced Si₃N₄ composite

Enhanced thermal conductivity and mechanical properties of a GNP reinforced Si₃N₄ composite

Spark Plasma Sintered Si₃N₄/TiN Nanocomposites Obtained by a Colloidal Processing Route

Carbon nanostructure-reinforced SiC_w/Si₃N₄ composite with enhanced thermal conductivity and mechanical properties

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SPS sintering of silicon nitride with fluoride additive

Cited by 37 publications

References 25 publications

Enhanced thermal conductivity and mechanical properties of a GNP reinforced Si3N4 composite

Enhanced thermal conductivity and mechanical properties of a GNP reinforced Si3N4 composite

Spark Plasma Sintered Si3N4/TiN Nanocomposites Obtained by a Colloidal Processing Route

Carbon nanostructure-reinforced SiCw/Si3N4 composite with enhanced thermal conductivity and mechanical properties

Contact Info

Product

Resources

About

Enhanced thermal conductivity and mechanical properties of a GNP reinforced Si₃N₄ composite

Enhanced thermal conductivity and mechanical properties of a GNP reinforced Si₃N₄ composite

Spark Plasma Sintered Si₃N₄/TiN Nanocomposites Obtained by a Colloidal Processing Route

Carbon nanostructure-reinforced SiC_w/Si₃N₄ composite with enhanced thermal conductivity and mechanical properties