Springback Analysis of Two-Layer Strips in Clad Cold Bimetal Bending

Shayan, Mohsen; Mohammadpour, Mohammad; Malaki, Massoud; Ding, Hongtao

doi:10.1007/s12666-014-0409-4

Cited by 5 publications

(2 citation statements)

References 21 publications

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“…Because of that, the elastic modulus of Cu is lower than that of Ni. When Ni is placed under Cu, the transverse stress of the transition layer after bending is compressive stress, which is slightly larger than that of the outer layer [24][25][26]. The stress neutral layer moves to the inner Ni layer and the bending moment increases.…”

Section: Effect Of Placement Modementioning

confidence: 99%

“…Kim et al [23] explored the effect of heat treatment temperature on the Cu/Al/Cu three-layer composite sheet. Shayan et al [24] found that the effect of the thickness of the single-layer had little effect on the springback. Yilamu et al [25] discovered that the placement of the specimen had an effect on the bending behavior and sheet thinning.…”

Section: Introductionmentioning

confidence: 99%

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Investigation on Springback Behavior of Cu/Ni Clad Foils during Flexible Die Micro V-Bending Process

Wang

et al. 2019

Metals

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With the increasing demand for micro parts using metal laminates in modern production, the manufacturing processes of thin sheet parts have been elevated. However, it is difficult to predict the deformation behavior with miniaturization because of size effects in micro-scale. In this study, the flexible die micro V-bending behavior of Cu/Ni clad foils was investigated. The bending experiments with three different punch angles and Cu/Ni clad foils under different annealed temperatures were performed. The results show that the springback angle increases with the increase of bending angle and annealing temperature. The placement of Cu/Ni clad foils induced compressive stress results in the more obvious thinning of thickness and decreasing of springback angle. The interactive effects of the distribution of deformation zones and compressive stress induced by the interface layer result in the springback behavior of Cu/Ni clad foils during the flexible die micro V-bending process.

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Section: Effect Of Placement Modementioning

confidence: 99%