“…The thin oxide layer of EGaIn (thickness of ∼3 nm, Ga 2 O 3 ) readily forms on the surface under ambient conditions via native oxidation, which imparts good adhesion to a variety of surfaces including low-surface energy nonpolar surfaces and polar surfaces . Owing to these characteristics, EGaIn particles have been successfully employed in various soft-electronic fabrication techniques such as direct writing, , spray deposition, , designed circuit transfer, , on a embedding single layer, , and shear mixing with matrix polymers. ,, In previous studies, by utilizing EGaIn particles with passivated Ga 2 O 3 layers, which can be easily fractured by a pressure of only a few kilopascals, stress-responsive electrical circuitries were demonstrated, where percolated liquid metal circuits were developed upon mechanical deformation ,,,,− The examples include pressure-sensitive circuits and stretchable electrodes. Owing to the difficulty of self-recovery to the original spherical droplets with the native oxide layers, most of the previously demonstrated liquid metals were, however, unsuitable for rewritable applications.…”