Spin-On Glass Films in Multilevel Ic Interconnection

Abstract

Among the variety of techniques available today for interlevel dielectric planarization, techniques based on spin-on glass (SOG) films are relatively attractive because of process simplicity and minimal equipment requirements.This paper reviews the materials and processes of SOG technology as it is applied in dielectric planarization. The SOG planarization schemes employ SOG films either as a permanent part of the interlevel insulation layer or as a sacrificial layer in the 'etch-back' techniques.The properties of the various types of comnircially available SOG materials are discussed in relation to their functional and processing characteristics.