Spectrophotometric Investigation of the Copper(II) Ion—Triethanolamine Complex

Bolling, John M.; Hall, James L.

doi:10.1021/ja01112a022

Cited by 14 publications

(10 citation statements)

References 2 publications

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“…There are a number of possible reasons for this behavior including differences in the complexing ability of ethanolamines toward copper(II) ions and the interaction of copper(II)–TEOA complexes with the SAM surface. There have been a number of studies of the formation of copper complexes with ethanolamines − using methods including polarography, spectrophotometry, potentiometry, and electron spin resonance spectroscopy. These studies show that there are differences in the structure and formation constants of copper complexes with EOA, DEOA, and TEOA. − Below pH ≈ 12, EOA and DEOA are believed to form complexes with Cu 2+ via the stepwise addition of two ligands to the metal center, followed by deprotonation of the two hydroxyl groups and chelation.…”

Section: Results and Discussionmentioning

confidence: 99%

“…Ethanolamines combine the properties of amines and alcohols and therefore have a variety of industrial applications as lubricants, surfactants, and herbicides and in gas purification. , They are versatile ligands that behave as N and O donors and easily form complexes with transition metals. ,− In ELD and electroplating, ethanolamines have been reported to act as both complexing agents and buffers. ,,,,, A number of studies have reported that TEOA increases the rate of copper deposition which has been attributed to the formation of Cu(II)–TEOA complexes or mixed ligand species (in the presence of other complexing agents). ,,,, TEOA can also slow the metal deposition rate by adsorbing onto the sample, which inhibits the oxidation of reducing agents, such as formaldehyde. , The properties of the deposited film are also altered by TEOA; the grain size is observed to decrease while the electrical resistivity is improved . There have been far fewer studies of the effect of ethanolamine (EOA) or diethanolamine (DEOA) on ELD and electroplating. , Hammami and co-workers observed differences in the morphologies of electroplated Zn–Ni films using DEOA and TEOA.…”

Section: Introductionmentioning

confidence: 99%

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Effect of Ethanolamines on the Electroless Deposition of Copper on Functionalized Organic Surfaces

Ellsworth

Walker

2018

Langmuir

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Electroless deposition (ELD) is widely used in industry to deposit metals because it is inexpensive and compatible with organic materials. The deposition rate and deposited film properties critically depend on the reducing agent, complexing agent, and bath pH and temperature as well as bath additives. We have investigated the role of ethanolamine additives in the ELD of copper using the reducing agent dimethylamine borane on -CH- and -OH-terminated self-assembled monolayers (SAMs) adsorbed on gold. Three additives were studied: ethanolamine (EOA), diethanolamine (DEOA), and triethanolamine (TEOA). Both the chemical identity and concentration of the ethanolamine significantly affect the deposition process. We show that the Cu deposition rate is faster on -CH-terminated surfaces than on -OH-terminated SAMs because of the stronger interaction of the ethanolamines with the hydroxyl terminal group. In contrast to physical vapor deposition and other ELD processes, Cu deposits atop methyl-terminated SAMs using TEOA. However, using EOA and DEOA, copper penetrates through -CH-terminated SAMs to the Au/S interface. For -OH-terminated SAMs, copper is observed to penetrate through the SAM for all ethanolamines investigated. The amount of copper penetration through the SAM to the Au/S interface increases with ethanolamine concentration. These effects are attributed to an adsorption-inhibition mechanism and differences in the chelation of Cu in the deposition bath.

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Section: Results and Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effect of Ethanolamines on the Electroless Deposition of Copper on Functionalized Organic Surfaces

Ellsworth

Walker

2018

Langmuir

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“…In the case of EDTA, the rate is independent of the concentration, since the adsorption equilibrium constant is very small (18). All Cu(II) ions in solution with TEA are considered to exist in the form of 1:1 complexes, because of the large equilibrium constant of Cu(II)-TEA complex formation (11)(12). However, in the third group, when TEA concentration was increased, an increase in the deposition rate was observed, and this cannot be explained by this mechanism.…”

Section: Discussionmentioning

confidence: 99%

“…Since all ligands used form 1:1 complexes with Cu(II) ions (11)(12)(13)(14)(15)(16)(17), the ligands exist in excess when the ligand concentration is higher than the concentration of Cu(II). Since all ligands used form 1:1 complexes with Cu(II) ions (11)(12)(13)(14)(15)(16)(17), the ligands exist in excess when the ligand concentration is higher than the concentration of Cu(II).…”

Section: Figures 2a and Bmentioning

confidence: 99%

Acceleration of Electroless Copper Deposition in the Presence of Excess Triethanolamine

Kawasaki

Ishikawa

Takenaka

et al. 1991

J. Electrochem. Soc.

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In our experiment, the 4-sulfonic esters with benzophenone were also much more effective, compared with that without the benzophenone. These results imply that polyamic acids are converted to the polyimides, catalyzed with photogenerated sulfonic acids during HIT-PEB process. The imidization should decrease the dissolution rate in basic aqueous solutions, due to the decrease in carboxylic acids and the rigid structure of the imides.The HIT-PEB process, however, cannot be explained by this single fact. Cross-linking of polyamic acids may take place through the naphthoquinone diazide residue, aided by sulfonic acids after the exposure and the post exposure bake. The cross-linking may not be significant in the unexposed area, where only thermal reactions of the diazide take place. What can be said at this stage is that the HIT-PEB process is caused by the difference in the reaction mechanism for naphthoquinone diazides between photolyses followed by thermal reactions and just thermal reactions. Details of reaction mechanisms are under study. ABSTRACTThe effects of addition of various ligands, such as ethylenediaminetetraacetic acid (EDTA), nitrilotriacetic acid, mine (TEA), and triisopropanolamine on the electroless copper deposition rate were examined. TEA was found to be the most effective ligand for increasing the electroless copper deposition rate. At lower TEA concentrations, the deposition rate increased until it peaked. After peaking, it decreased with increasing concentrations. The maximum rate was over 20 times faster than the current rate observed in the EDTA system. A new deposition model was proposed to derive the adsorption kinetics and to understand the effects of excess ligand. The adsorption equilibrium constant of ligands on the reactive surface and that on the adsorbed complexes were also determined. ) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 137.99.31.134 Downloaded on 2015-04-13 to IP ) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 137.99.31.134 Downloaded on 2015-04-13 to IP ) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 137.99.31.134 Downloaded on 2015-04-13 to IP

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“…Hall et al 8,9) have also studied the interaction between copper (II) and ethanolamines, such as monoethanolamine (MEA), diethanolamine (DMA), and triethanolamine (TEA), in the presence of a strong base. The methods employed in their study were polarography, spectrophotometry and electrical migration.…”

Section: Stabilitymentioning

confidence: 99%

Stability Order in Metal Chelate Compounds. IV. 2-Pyridylmethanol Complexes

Murakami¹,

Takagi²

1965

Bulletin of the Chemical Society of Japan

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The complexing behavior of 2 - pyridylmethanol with magnesium(II), manganese(II), cobalt(II), nickel(II), copper(II), zinc(II) and cadmium(II) has been studied in aqueous media at 25.0±0.1°C and an ionic strength of 0.10 m (KNO3). The stability constants for the 1 : 1 (ligand to metal) complexes of manganese(II), cobalt(II), nickel(II), copper(II), zinc(II) and cadmium(II) with the neutral 2-pyridylmethanol and also for the 2 : 1 complexes of nickel(II) and copper(II) have been evaluated. The resulting stability order with respect to the bivalent metals has been found to follow the sequence: Cd(II)<Mn(II)<Zn(II)<Co(II)<Ni(II)<Cu(II) The higher stability of the present complexes relative to the corresponding pyridine complexes may be ascribed to the formation of a chelate ring which involves the hydroxyl group of the ligand. After the complex formation between metal ions and the neutral ligand has proceeded to a certain extent, the liberation of a hydroxyl proton from the complex was observed to occur in several metal complex systems. This tendency was greatest for the copper complex, followed by the zinc, nickel and cobalt complexes in this order. Acid dissociation constants for the 1:1 and 2:1 copper complexes have also been evaluated. Several pieces of evidence have been obtained in support of the coördination ability of the hydroxyl group of the present ligand in its anionic form. The neutral copper chelate, bis(2-pyridylmethanolato)copper(II), as well as other various copper 2-hyridylmethanolate chelates which involve acetate, chloride, iodide, nitrite and thiocyanate ions as the third component, has been isolated. Acetato(2-pyridylmethanolato)-copper(II) has been found to exist as the tetrameric form in chloroform.

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Spectrophotometric Investigation of the Copper(II) Ion—Triethanolamine Complex

Cited by 14 publications

References 2 publications

Effect of Ethanolamines on the Electroless Deposition of Copper on Functionalized Organic Surfaces

Effect of Ethanolamines on the Electroless Deposition of Copper on Functionalized Organic Surfaces

Acceleration of Electroless Copper Deposition in the Presence of Excess Triethanolamine

Stability Order in Metal Chelate Compounds. IV. 2-Pyridylmethanol Complexes

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