2012
DOI: 10.1007/s00170-012-4402-y
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Spatter reduction in nanosecond fibre laser drilling using an innovative nozzle

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Cited by 20 publications
(6 citation statements)
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“…After drilling and ultrasonic cleaning the bore diameters of 20 randomly chosen holes are measured my microscopy both on the top and the bottom side. To determine the hole circularity its diameter is measured on the minor and major axes of the equivalent ellipse and calculated by the ratio between them (Biffi and Previtali, 2012). Formula (6) is used to calculate the taper T from the hole diameter on the top side D top , the bottom side D bottom and the material thickness t (Biffi and Previtali, 2012):…”
Section: Process Stability Circularity and Tapermentioning
confidence: 99%
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“…After drilling and ultrasonic cleaning the bore diameters of 20 randomly chosen holes are measured my microscopy both on the top and the bottom side. To determine the hole circularity its diameter is measured on the minor and major axes of the equivalent ellipse and calculated by the ratio between them (Biffi and Previtali, 2012). Formula (6) is used to calculate the taper T from the hole diameter on the top side D top , the bottom side D bottom and the material thickness t (Biffi and Previtali, 2012):…”
Section: Process Stability Circularity and Tapermentioning
confidence: 99%
“…The green body ceramic had much less splatter than the sintered ceramic and no problems with cracks. Jiao et al (2014) halved splatter area during femtosecond laser drilling of silicon wafers by heating the wafer from 300 K to 773 K. Further methods to avoid splatter as drilling using special nozzles with cross jet contacting the material (Biffi and Previtali, 2012) or drilling under liquids (Jiao et al, 2011) are not commonly in practice.…”
Section: Introductionmentioning
confidence: 98%
“…This results in a better focussing and then higher cutting speeds with comparable or better kerf quality, in term of: small dimension, spatter and dross absence, recast layer and HAZ extension. Furthermore, this characteristics are enhanced by the use of high quality short and ultrashort pulsed laser [13][14][15][16][17][18]. However, when the material thickness is limited (<1 mm), the use of a high quality fibre laser, working in CW or modulated regime, could be an economical and practical solution, as demonstrated in [19][20].…”
Section: Introductionmentioning
confidence: 99%
“…Thus, the type of assist gases must be selected carefully depending on the laser set up and material properties. Previous laser drilling works on various materials involving assist gases are summarised in Table 2.1 , Rodden et al 2001, Khan et al 2004, Ghoreishi and Nakhjavani 2008, Okasha et al 2010, Webster et al 2010, Choudhury et al 2012, Biffi and Previtali 2013.…”
Section: Assist Gasesmentioning
confidence: 99%
“…The role of different gases on removing spatter was already summarised and discussed in Section 2.2.4. Hence, only one study (Biffi and Previtali 2013) involving an innovative gas nozzle is introduced in this section. Biffi and Previtali proposed a shielding gas nozzle which was designed to completely contact with the target material during laser drilling.…”
Section: Spattermentioning
confidence: 99%