Sparse deep encoded features with enhanced sinogramic red deer optimization for fault inspection in wafer maps
Doaa A. Altantawy,
Mohamed A. Yakout
Abstract:Due to the complexity and dynamics of the semiconductor manufacturing processes, wafer bin maps (WBM) present various defect patterns caused by various process faults. The defect type detection on wafer maps provides information about the process and equipment in which the defect occurred. Recently, automatic inspection has played a vital role in meeting the high-throughput demand, especially with deep convolutional neural networks (DCNN) which shows promising efficiency. At the same time, the need for a large… Show more
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