Spark assisted chemical engraving in the light of electrochemistry

Fascio, Valia; Wüthrich, Rolf; Bleuler, Hannes

doi:10.1016/j.electacta.2003.12.062

Cited by 137 publications

(62 citation statements)

References 12 publications

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“…A first linear region (Ohmic region) is observed, followed by a plateau at voltages higher than U lim (typically around 10-12 V), before reaching the critical voltage U crit where the gas film is formed. For more details see, for example, [10].…”

Section: Mechanisms Involved In the Gas Film Formationmentioning

confidence: 99%

Physical principles and miniaturization of spark assisted chemical engraving (SACE)

Wüthrich¹,

Hof²,

Lal³

et al. 2005

J. Micromech. Microeng.

106

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Spark assisted chemical engraving (SACE) is an unconventional micromachining technology based on electrochemical discharge phenomena for glass and various ceramics. The limits of SACE with respect to small dimensions in the particular case of glass are explored. It is found, using a specially developed set-up based on an AFM, that even using extremely sharp tool-electrodes does not allow us to produce a smaller pattern than typically 25 µm. It is concluded that the gas film thickness, in which the electrochemical discharges take place, is the main limiting factor. Further experimental investigations on its formation are investigated. By adding surfactants to the electrolyte, in order to increase the wettability of the tool-electrode and therefore to reduce the gas film thickness, it is observed experimentally that the critical voltage reduces significantly. This observation may lead to a novel method of characterizing the gas film thickness in SACE.

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Section: Mechanisms Involved In the Gas Film Formationmentioning

confidence: 99%

Physical principles and miniaturization of spark assisted chemical engraving (SACE)

Wüthrich¹,

Hof²,

Lal³

et al. 2005

J. Micromech. Microeng.

106

View full text Add to dashboard Cite

show abstract

“…The process is compared to EDM using a metal matrix composite as the machining sample. A thermal model to predict the machining depth has been developed [14]. The model provides unsatisfactory results when the machining voltages are less than 25 V. One of the mechanism proposed for the onset of the electrochemical discharges after the critical voltage is based on a valve theory [15].…”

Section: Literature Reviewmentioning

confidence: 99%

A mathematical model to predict overcut during electrochemical discharge machining

Kamaraj

Jui

Cai

et al. 2015

Int J Adv Manuf Technol

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Overcut is a major reason for the dimensional deviations, especially during high aspect ratio micromachining in electrochemical discharge machining (ECDM). Since electrolyte concentration plays a vital role in material removal, by understanding the effect of electrolyte concentration on the machined feature, it is possible to reduce the overcut associated with the ECDM process. This reduction in overcut was used in the study to drill high aspect ratio microholes in glass. The effect of concentration on the overcut is explained with an analytical model. The model considers the thermal effects on material removal for ECDM assuming a high-temperature chemical etching mechanism for the material removal. It describes the effect of electrolyte concentration as well as machining time on material removal. Results reveal that at the microscale, tool diameter has minimal effect on overcut for a given machining voltage. Microholes with aspect ratios as high as 12 were produced in glass in this study.

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“…Kulkarni 16,17 , et al have successfully explained the ECS process investigating the basic discharge mechanism by experimental measurements. A novel technology for micromachining of glass, called spark-assisted chemical engraving (SACE) using ECS 18 is presented. This technology is based on electrochemical discharge phenomena.…”

Section: Literature Surveymentioning

confidence: 99%

Electrochemical Discharge Machining Process

Kulkarni¹

2007

DSJ

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Electrochemical discharge machining process is evolving as a promising micromachining process. The experimental investigations in the present work substantiate this trend. In the present work, in situ, synchronised, transient temperature and current measurements have been carried out. The need for the transient measurements arose due to the time-varying nature of the discharge formation and time varying circuit current. Synchronised and transient measurements revealed the discrete nature of the process. It also helped in formulating the basic mechanism for the discharge formation and the material removal in the process. Temperature profile on workpiece and in electrochemical discharge machining cell is experimentally measured using pyrometer, and two varieties of K-type thermocouples. Surface topography of the discharge-affected zones on the workpiece has been carried out using scanning electron microscope. Measurements and surface topographical studies reveal the potential use of this process for machining in micron regime. With careful experimental set-up design, suitable supply voltage and its polarity, the process can be applied for both micromachining and micro-deposition. It can be extended for machining and or deposition of wide range of materials.

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Spark assisted chemical engraving in the light of electrochemistry

Cited by 137 publications

References 12 publications

Physical principles and miniaturization of spark assisted chemical engraving (SACE)

Physical principles and miniaturization of spark assisted chemical engraving (SACE)

A mathematical model to predict overcut during electrochemical discharge machining

Electrochemical Discharge Machining Process

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