Spaceflex onboard digital transparent processor: a new generation of DTP with optical digital interconnects

Abstract

As high-speed digital signal processing has become a reality taking an increasing place in telecom satellite payloads for today, Thales Alenia Space has introduced the most advanced and disruptive technologies in his new generation of onboard digital transparent processor (DTP). DTP namely Spaceflex is an advanced repeater sub-systems having analogueto-digital (ADC) and digital-to-analogue (DAC) channelizers on their input and output accesses and making extensive use of digital processing to support channel routing with fine bandwidth granularity. The mechanical architecture of such advanced digital processor is based on input/output routing channel modules and switch modules interconnected together thanks to optical interconnect technology already implemented in a breadboard developed under the ESTEC contract Optical Inter-board Interconnects for High Throughput on-Board Processors (OI2) but showing higher performances requested by the application. The optical interconnect is supported by optical transceiver, by optical connectors for inside and outside equipment interconnects, by optical cables and flexes. This optical interconnect solution is scalable to an overall throughput in excess of 15 Terabit/s with 150's of optical links. In the frame of this development, Thales Alenia Space has identified and tested 3 different optical transceivers working at high speed data rate higher than 10 Gbps, compatible with GEO and LEO environment whose reliability is compatible with a lifetime of 15 years. The paper will present in detail the tests on selected transceiver (radiation behaviour and temperature) as well as the overall architecture of such advanced digital on board processing equipment.

Optical interconnect evaluation process for Thales Alenia Space latest generation of Digital Transparent Processor, DTP6G, and a projection into future needs

“…Since DTP5G, high-speed electrical interconnects have been replaced by optical interconnects [1,2,3,4]. On DTP5G, optical transceivers working at high speed data rate higher than 10 Gbps were introduced after a selection and qualification process [5,6,8]. Needs for even higher data rates over more links with optimized mass and power budgets for DTP6G led to a reassessment of the optical interconnect architecture and the selection of new transceiver operating at data rates higher than 20 Gbps.…”

High-speed optical transceiver integrated chipset and module for on-board VCSEL-based satellite optical interconnects

“…On the other hand, OI have already reached TRL 9 and thanks to the use of lightweight ribbon fiber optic cables and ruggedized dense multi-ferule connectors [2], they offer >90% savings in mass and volume consumption with respect to coaxial cables, whereas being capable to support higher data rates. OI have recently made their debut in commercial missions through the launch of Eutelsat KONNECT VHTS, which hosts Thales Alenia Space DTP5G OBP [3] a processor with digital optical links operating at 10 Gb/s data lanes for board-to-board interconnections. To further promote the deployment of intra-satellite OI, ESA released the ECSS-E-ST-50-11C standard [4] which specifies SpaceFibre optical links operating at data signaling rates in the range of 6.25 to 10 Gb/s, with a system requirements roadmap extending beyond 25 Gb/s.…”

A 112 Gb/s Radiation-Hardened Mid-Board Optical Transceiver in 130-nm SiGe BiCMOS for Intra-Satellite Links

“…Basically, a V/HTS must be able to deliver the required capacity where and when needed. It must also be able to serve various and evolving demands [1].…”