Space Domain Reflectometry for open failure localization

Gaudestad, J.; Talanov, V. I.; Gagliolo, Nicolas; Orozco, Antonio

doi:10.1109/ipfa.2012.6306311

Cited by 10 publications

(4 citation statements)

References 8 publications

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“…Only recently has new developments enabled MFI to also localize open defects through the use of a high frequency standing wave using the MFI sub technique Space Domain Reflectometry (SDR) [8][9][10][11].…”

Section: Magnetic Field Imaging (Mfi)mentioning

confidence: 99%

Magnetic Field Imaging for non destructive 3D IC testing

Gaudestad

Orozco

2014

Microelectronics Reliability

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Section: Magnetic Field Imaging (Mfi)mentioning

confidence: 99%

Magnetic Field Imaging for non destructive 3D IC testing

Gaudestad

Orozco

2014

Microelectronics Reliability

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“…Generally, the SQUID sensor is first used for overall scanning to obtain the approximate location of defects, and the GMR sensor is used for detailed scanning to obtain high-resolution (sub-micron) imaging. In SDR application, the SQUID sensor can detect an RF (~40 MHz) current forming a standing wave when the trace is open [20]. Possible limitations for the SQUID sensor are mainly lack of resolution.…”

Section: Introductionmentioning

confidence: 99%

Open Localization in 3D Package with TSV Daisy Chain Using Magnetic Field Imaging and High-Resolution Three-Dimensional X-ray Microscopy

et al. 2021

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With the development of 3D integrated packaging technology, failure analysis is facing more and more challenges. Defect localization in a 3D package is a key step of failure analysis. The complex structure and materials of 3D package devices demand non-destructive defect localization technology for full packages. Magnetic field imaging and three-dimensional X-ray technology are not affected by package material or form. They are effective methods to realize defect localization on 3D packages. In this paper, magnetic field imaging and high-resolution three-dimensional X-ray microscopy were used to localize the open defect in a 3D package with a TSV daisy chain. A two-probe RF method in magnetic field imaging was performed to resolve isolation of the defect difficulties resulting from many different branches of TSV daisy chains. Additionally, a linear decay method was used to target sub-micron resolution at a long working distance. Multiple partition scans from a high-resolution 3D X-ray microscopy with a two-stage magnification structure were used to achieve sub-micron resolution. The open location identified by magnetic field imaging was consistent with that identified by a three-dimensional X-ray microscope. The opening was located on the top metal in the proximity of the fifth via. Physical failure analysis revealed the presence of a crack in the top metal at the opening location.

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“…Existing DC magnetic sensing technology utilizes superconducting quantum interference devices (SQUID) [9,10] and giant magnetoresistance (GMR) magnetometers [11]. SQUIDs are also capable of locating opens by detecting an AC signal propagating through the path [12][13][14]. However, these methods require point-by-point scanning to build up images, require cryogenics and vacuum shrouds in the case of SQUIDs, and can only detect the out-of-plane field component (Bz), which prevents current detection in TSVs or Cu-Cu interconnects.…”

Section: Introductionmentioning

confidence: 99%

Vector Magnetic Current Imaging of an 8 nm Process Node Chip and 3D Current Distributions Using the Quantum Diamond Microscope

Oliver

Martynowych

Turne

et al. 2021

International Symposium for Testing and Failure Analysis

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The increasing trend for industry adoption of three-dimensional (3D) microelectronics packaging necessitates the development of new and innovative approaches to failure analysis. To that end, our team is developing a tool called the quantum diamond microscope (QDM) that leverages an ensemble of nitrogenvacancy (NV) centers in diamond for simultaneous wide fieldof- view, high spatial resolution, vector magnetic field imaging of microelectronics under ambient conditions [1,2]. Here, we present QDM measurements of two-dimensional (2D) current distributions in an 8 nm process node flip chip integrated circuit (IC) and 3D current distributions in a custom, multi-layer printed circuit board (PCB). Magnetic field emanations from the C4 bumps in the flip chip dominate the QDM measurements, but these prove to be useful for image registration and can be subtracted to resolve adjacent current traces on the micron scale in the die. Vias, an important component in 3D ICs, display only Bx and By magnetic fields due to their vertical orientation, which are challenging to detect with magnetometers that traditionally only measure the Bz component of the magnetic field (orthogonal to the IC surface). Using the multi-layer PCB, we demonstrate that the QDM's ability to simultaneously measure Bx, By, and Bz magnetic field components in 3D structures is advantageous for resolving magnetic fields from vias as current passes between layers. The height difference between two conducting layers is determined by the magnetic field images and agrees with the PCB design specifications. In our initial steps to provide further z depth information for current sources in complex 3D circuits using the QDM, we demonstrate that, due to the linear properties of Maxwell's equations, magnetic field images of individual layers can be subtracted from the magnetic field image of the total structure. This allows for isolation of signal from individual layers in the device that can be used to map embedded current paths via solution of the 2D magnetic inverse. Such an approach suggests an iterative analysis protocol that utilizes neural networks trained with images containing various classes of current sources, standoff distances, and noise integrated with prior information of ICs to subtract current sources layer by layer and provide z depth information. This initial study demonstrates the usefulness of the QDM for failure analysis and points to technical advances of this technique to come.

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Space Domain Reflectometry for open failure localization

Cited by 10 publications

References 8 publications

Magnetic Field Imaging for non destructive 3D IC testing

Magnetic Field Imaging for non destructive 3D IC testing

Open Localization in 3D Package with TSV Daisy Chain Using Magnetic Field Imaging and High-Resolution Three-Dimensional X-ray Microscopy

Vector Magnetic Current Imaging of an 8 nm Process Node Chip and 3D Current Distributions Using the Quantum Diamond Microscope

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