Some passivation studies on tin electrodes in alkaline solutions

Pugh, Marshall R.; Warner, LangdonHG; Gabe, D. R.

doi:10.1016/s0010-938x(67)80114-8

Cited by 56 publications

(18 citation statements)

References 14 publications

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“…This behavior is due to the amphoteric nature of the metal: solubility of tin hydroxides is higher at lower pH values, while at higher pH values the formation of stannites and stannates increases the solubility of the formed oxides. 13 Regarding the composition of the film there is some disagreement in the literature 1,[14][15][16][17][18][19][20][21][22][23][24][25][26][27][28][29] and the electrochemical oxidation mechanism remains unclear.…”

Section: Introductionmentioning

confidence: 99%

“…Thus, in general, it is proposed that the result of the first passivation step is a thin layer of Sn(IV) hydroxide. In very alkaline solutions, Shams El Din and Abd El Wahab 25 concluded that the primary passivation of tin occurs when the metal is covered with a film of Sn(OH) 2 or SnO, and then permanent passivity occurs with a continuous layer of Sn(OH) 4 covering the surface, while Varsanyi et al, 14 using Mössbauer spectroscopy, found that the film formed at low potentials was duplex, consisting on highly amorphous Sn(OH) 2 28,29 More recently, it has been reported that tin behaves as a typical valve metal and that the growth of the film involves field-assisted migration of ions through the oxide. 20 The films were found to be nonstoichiometric, having an excess of tin atoms or oxygen vacancies that resulted in n-type conductivity.…”

Section: Introductionmentioning

confidence: 99%

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An electrochemical study of tin oxide thin film in borate buffer solutions

Dı́az¹,

Díez‐Pérez²,

Gorostiza³

et al. 2003

J. Braz. Chem. Soc.

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Neste trabalho, foi estudado o comportamento eletroquímico de estanho policristalino em soluções de tampão borato com pH 7.5, utilizando voltametria cíclica, eletroquímica com microscopia de varredura (EC-STM) e espectroscopia de impedância eletroquímica. Os potenciais do pico principal de redução do óxido e de geração de hidrogênio deslocaram-se de forma sistemática para valores mais negativos quando se aumentou o potencial anódico de formação do filme. Foi discutida a natureza dos diferentes óxidos formados e também foi dada nova atribuição aos processos de oxidação do estanho e de redução de seus óxidos.The electrochemical behavior of tin polycrystals in borate buffer solutions at pH 7.5 was systematically investigated using cyclic voltammetry, EC-STM and electrochemical impedance measurements. A systematic shift to more negative values of the potentials corresponding either to the major reduction peak either to the hydrogen evolution was measured when the anodization potential used for film growth was increased. A discussion about the different oxides there formed was included and a reassignation of tin oxidation and tin oxides reduction processes was given.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

An electrochemical study of tin oxide thin film in borate buffer solutions

Dı́az¹,

Díez‐Pérez²,

Gorostiza³

et al. 2003

J. Braz. Chem. Soc.

View full text Add to dashboard Cite

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“…Passivation of tin in the presence of NaOH at 0.1 M concentration has been already reported [11,13,36,47]. The linear voltammogram of tin in the À2 to +2 V/MSE potential range is shown in case A of Fig.…”

Section: Passivation Of Tin In Naoh Solutionmentioning

confidence: 68%

“…Numerous studies have been devoted to passivate electrochemically tin electrodes in the presence of various electrolyte solutions, notably in alkaline media owing to its industrial applications [9][10][11]18,20,[35][36][37][38][39]. Although the exact mechanism leading to passivation still offers debate in the literature, a consensus view is that tin passivity results from the formation of a final SnO 2 layer [40][41][42][43][44][45][46][47].…”

Section: Passivation Of Tin In Naoh Solutionmentioning

confidence: 99%

The comparative breakdown of passivity of tin by fluorides and chlorides interpreted through the ‘law of matching affinities’ concept

Trompette

2015

Corrosion Science

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a b s t r a c tThe comparative breakdown of passivity of tin by fluorides and chlorides highlight the significant slower kinetics of attack by the kosmotrope fluoride when compared to the chaotrope chloride at pH 5.7 and 10. The origin of this difference is ascribed to the predominant halide-dependent mechanism of attack, pitting with chlorides and film thinning with fluorides, which is conditioned according to the anion-specific hydration properties.

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“…Peak I has therefore been attributed to the formation of either SnO or Sn(OH) 2 17,18 Equations 5 and 6 show that these two species form at similar potentials. 17,30 Peak II has been attributed to the oxidation of SnO or Sn(OH) 2 to Sn(OH) 4 , which may subsequently become dehydrated to form SnO 2 .…”

Section: Electrochemical Characterization; Cathodic Oxygen Reduction mentioning

confidence: 99%

The Kinetics and Mechanism of Atmospheric Corrosion Occurring on Tin and Iron-Tin Intermetallic Coated Steels

Wint

Geary

McMurray

et al. 2015

J. Electrochem. Soc.

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This paper describes a systematic study into the initiation and propagation of cathodic delamination on pure iron, pure tin and industrially important tin and iron-tin intermetallic (FeSn and FeSn 2 ) coatings for packaging steels, as a function of coating weight. Cathodic disbondment rates for an organic lacquer overcoat applied to the various metallic coatings are determined using an in-situ scanning Kelvin probe technique. Cathodic disbondment was not observed on pure tin and was found to propagate at reduced rates on the FeSn and FeSn 2 intermetallic coatings, relative to pure iron. An explanation of these findings is given in terms of electrocatalytic activity of various metallic surfaces for the cathodic oxygen reduction reaction. It is shown that the relative susceptibility of Fe, Sn, FeSn and FeSn 2 to cathodic disbondment increases with decreasing cathodic overpotential and is independent of metallic coating weight. Tin is traditionally used for the corrosion protection of packaging steel. Conventional tinplate is typically produced by initially electrodepositing a porous layer of pure tin (∼2.8 g.m −2 -11.2 g.m −2 ) onto the cathodic steel substrate, as shown in Figure 1a, and heating above the melting point of tin (reflowing). [1][2][3] Reflowing causes the tin layer to become fully dense (bright tin) and also allows creation of partial or complete iron-tin intermetallic, typically FeSn 2 , as shown in Figure 1b [1][2][3] .Recently the increasing price of tin in the commodities market has resulted in a need to reduce the amount of tin used in tinplate materials (tin coating weight) whilst retaining adequate corrosion resistance. One approach to doing this has been to diffusion anneal the unflowed tin (<1g.m −2 ) in a reducing atmosphere at temperatures above 500 • C 4,5 in such a way that almost all (preferably 90-98%) 6 of the free tin is converted to an iron-tin (FeSn) intermetallic as shown in Figure 1c. It has previously been found that heating to these temperatures leads to increased tin diffusion to the substrate and formation of a continuous FeSn layer which is more uniform and dense than the conventional FeSn 2 layer. 4 The principal purpose of tin in tinplate packaging materials is to provide corrosion resistance. Furthermore, in modern packaging, corrosion resistance is enhanced by using tinplate in conjuction with an organic (laquer or laminate) overcoat. Consequently mechanisms of corrosion driven coating delamination are of particular concern. The aim of the current paper is to present a detailed study of the role of free tin and iron-tin intermetallic layers in resisting atmopheric corrosion, specifically cathodic disbondment, as it affects lacquer coated packaging material.During cathodic delamination the separation of the organic coating from the metal substrate is linked to the cathodic reduction of oxygen. Within the localized corrosion cell anodic metal dissolution located in the vicinity of the defect is coupled to the cathodic delamination front by a thin (<5 μm) gel like electrol...

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Some passivation studies on tin electrodes in alkaline solutions

Cited by 56 publications

References 14 publications

An electrochemical study of tin oxide thin film in borate buffer solutions

An electrochemical study of tin oxide thin film in borate buffer solutions

The comparative breakdown of passivity of tin by fluorides and chlorides interpreted through the ‘law of matching affinities’ concept

The Kinetics and Mechanism of Atmospheric Corrosion Occurring on Tin and Iron-Tin Intermetallic Coated Steels

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