Some Investigations on Wiring In New Generation Multichip Modules Applied in High Speed Large Scale of Integration Telecommunication Units

Studying electro‐physical material characteristics of vacuum‐deposited layers of aluminium (tantalum) when using aluminium sheet as a carrier for MCM, interconnections, vias and resistive groups

“…In order to eliminate test fixture and mismatch errors we emphasize on the following circumstances: The broadband digital transmission behaviour or the stripe lines is better ensured (eliminating the mismatch errors due to the unified impedance of the measurement equipment) when the wave impedances are closer to 50 (70) Ohms.It is easier to match unknown high frequency complex impedances of active devices and passive components to the load or generator when applying 50 Ohms transmission line circuits. Thus the rise, fall time and plateau form of high speed digital impulses are preserved.The input transmission line impedance S 11 is suitable for interconnection line parameters’ evaluation (Figure 10b) that is the dielectric film thickness, permittivity, line width and metal film thickness.The transmission line factor S 21 (the insertion losses) are suitable for an indirect material media evaluation: metal sheet resistance, bulk dielectric isolation, losses, tg δ and factor of merit.In future investigations, increasing frequency band operations, it is desirable to use the microwave “resonator” measurement method in order to facilitate the accuracy of the results and the verification of the initial computer simulations, done in previous papers[2, 3, 6]. …”

“…In future investigations, increasing frequency band operations, it is desirable to use the microwave “resonator” measurement method in order to facilitate the accuracy of the results and the verification of the initial computer simulations, done in previous papers[2, 3, 6].…”

“…The utilization of metal substrates as a base of electron device package or MCM carrier is known with certain advantages[1]. When reaching a proper electric isolation in this way a good heat dissipation, mechanical strength and other famous priorities are applied[2, 3]. The electric isolation could be achieved through dielectric films with proper breakdown voltage, permittivity, minimum current conductance, temperature stability of dielectric media, including preservation of the isolating qualities when exposed to aging tests[3].…”

“…The most similar technology process is that applied in the Se copier drums. As already mentioned several times[2, 4], the material system Al/Al 2 O 3 may possess matched mechanical properties which allow building up electric interconnections (wiring) by preliminary tracing project as in PCBs. The simplest variant is the application of two conducting levels on the Al 2 O 3 side, which include conducting interconnections with “X” and “Y” orientation, vias and through hole connections between themselves and the metal base substrate, if necessary.…”

Characteristics of passive Ta‐resistive planes embedded in Al‐sheet “PCB” ‐ compatible for integrated MCM‐substrates or packaging carriers

“…Several recent research papers deal with the design possibilities of metal substrate carriers suitable, due to their mechanical strength, as packaging base or as MCM chip carriers[1, 2, 3] (Figure 1).…”