Solvent extraction separation of Au(III) from Pd(II), Cu(II), Ni(II) in HCl solution using cationic, neutral and basic extractants
Thi Nhan Hau Nguyen,
Si Jeong Song,
Man Seung Lee
Abstract:BackgroundEtching solutions of spent printed circuit boards (PCBs) contain precious metal ions like Au(III) and Pd(II) together with Cu(II). Therefore, it is crucial to recover Au(III) and Pd(II) from these solutions. To investigate the possibility of separating Au(III) from the etching solutions, solvent extraction experiments were conducted using synthetic hydrochloric acid solutions containing Au(III), Pd(II), Cu(II), and Ni(II). The solvent extraction behavior of these four metal ions was investigated by u… Show more
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