2020
DOI: 10.1109/led.2020.2992264
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Solution-Processed La Alloyed ZrOx High-k Dielectric for High-Performance ZnO Thin-Film Transistors

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Cited by 19 publications
(46 citation statements)
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“…[ 29 ] Higher bond dissociation energy leads to the stronger metal–oxygen network and less oxygen vacancy, which helps to improve the stability of the TFTs. [ 30 ] A Gd has lower electronegativity (1.20) compare to Zn (1.65), lower SEP (−2.27 V) compare to Zn (−0.76 V) and higher bond dissociation energy (719 kj mole −1 ) compare to Zn (250 kj mole −1 ). Therefore, Gd can be a good candidate for doing in ZnO to improve the stability of TFT.…”
Section: Introductionmentioning
confidence: 99%
“…[ 29 ] Higher bond dissociation energy leads to the stronger metal–oxygen network and less oxygen vacancy, which helps to improve the stability of the TFTs. [ 30 ] A Gd has lower electronegativity (1.20) compare to Zn (1.65), lower SEP (−2.27 V) compare to Zn (−0.76 V) and higher bond dissociation energy (719 kj mole −1 ) compare to Zn (250 kj mole −1 ). Therefore, Gd can be a good candidate for doing in ZnO to improve the stability of TFT.…”
Section: Introductionmentioning
confidence: 99%
“…[ 17,26 ] In general, amorphous dielectric films are more favorable owing to the smoother surface, lower leakage current, and higher breakdown electric field compared to crystalline counterparts. [ 4,17,27 ] On the other hand, Zr has higher metal–oxygen (M–O) bond strength (760 kJ mol −1 ) than Al (511 kJ mol −1 ), which can enhance the M–O bonds and effectively reduces the trap states at the dielectric/semiconductor interface. [ 4,15a,28 ] In addition, compared to the vacuum‐based deposition technique, solution process (e.g., spin coating, slot‐die coating, spray pyrolysis, and inkjet printing) provides extra benefits such as low‐cost and easy chemical controllability.…”
Section: Introductionmentioning
confidence: 99%
“…[ 4,17,27 ] On the other hand, Zr has higher metal–oxygen (M–O) bond strength (760 kJ mol −1 ) than Al (511 kJ mol −1 ), which can enhance the M–O bonds and effectively reduces the trap states at the dielectric/semiconductor interface. [ 4,15a,28 ] In addition, compared to the vacuum‐based deposition technique, solution process (e.g., spin coating, slot‐die coating, spray pyrolysis, and inkjet printing) provides extra benefits such as low‐cost and easy chemical controllability. [ 2,15a,11 ] Particularly, spin coating and inkjet printing have been attracted to fabricate the MO‐TFTs.…”
Section: Introductionmentioning
confidence: 99%
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“…Next-generation displays demand low cost technology with high-performance thin-film transistors (TFTs) operated at low voltage, which should be manufactured over large area with good uniformity. Spray pyrolysis is one of the promising technologies due to its low cost and large-scale uniform deposition, compared to other solution-processed techniques such as ink-jet printing and spin coating [1][2][3][4][5]. Among various metal-oxide (M-O) semiconductors, ZnO is a well-known oxide because of its excellent electrical and optical properties due to its crystalline structure with high carrier mobility and tunable bandgap by alloying [2].…”
Section: Introductionmentioning
confidence: 99%