Solution for improving manufacturing yield and reliability of package-on-package (PoP)

Xie, Bin; Shi, Daniel; Chung, Tom

doi:10.1109/phm.2010.5414595

Cited by 2 publications

(1 citation statement)

References 15 publications

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“…Die embedded in the substrate which bonded to the underlying pad with golden wires; upper and lower substrates are interconnected by solder ball, after reflow soldering, the whole POP as a SOC was soldered to the printed circuit board [2,3,6]. However, traditional POP which adopted the bump interconnection with the solder balls may result in some issues, such as shifting, the bridging of adjacent solder balls, and the warpage of the substrate due to the different thermal stress which seriously influenced the practical application [4,5,7]. This paper proposes a novel stacking method to solve the problems of interconnection and stacking accuracy mentioned above.…”

Section: Introductionmentioning

confidence: 99%

A novel stacking method of filling hole used in package on package

Shi

Zheng

Lai

et al. 2013

2013 IEEE International Symposium on Advanced Packaging Materials

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With the developing of the electronics industry, 3-D package stack has been a new trend.Currently, most of the package on package (POP) stack adopted the bump interconnection with the solder balls, resulted in some issues, such as bridging, shifting and warpage. In this paper, a novel stacking method is presented to solve the problems of interconnection and stacking accuracy mentioned above. The insulating medium was adhered to the substrate; a hole was drilled according to the interconnection requirement. Then the hole is filled with copper and interconnects the substrates through the insulating medium. Meanwhile, this lead-free soldering stacking method of filling hole adapt to the global green manufacturing trend.

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