2014
DOI: 10.1021/am506999p
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Solution-Deposited F:SnO2/TiO2 as a Base-Stable Protective Layer and Antireflective Coating for Microtextured Buried-Junction H2-evolving Si Photocathodes

Abstract: Protecting Si photocathodes from corrosion is important for developing tandem water-splitting devices operating in basic media. We show that textured commercial Si-pn(+) photovoltaics protected by solution-processed semiconducting/conducting oxides (plausibly suitable for scalable manufacturing) and coupled to thin layers of Ir yield high-performance H2-evolving photocathodes in base. They also serve as excellent test structures to understand corrosion mechanisms and optimize interfacial electrical contacts be… Show more

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Cited by 86 publications
(95 citation statements)
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“…(B) Bottom cell H 2 evolving photoelectrodes using Refs. . (C) Top cell H 2 evolving photoelectrodes using Refs.…”
Section: Tandem Photocatalytic Water Splitting Analysismentioning
confidence: 99%
“…(B) Bottom cell H 2 evolving photoelectrodes using Refs. . (C) Top cell H 2 evolving photoelectrodes using Refs.…”
Section: Tandem Photocatalytic Water Splitting Analysismentioning
confidence: 99%
“…Thin amorphous materials (< 4 nm) possess the passage of high current densities (> 1 A cm −2 ) 7 for efficient photoelectrodes, but, are not stable in this case. To the best of my knowledge, amorphous oxides for stabilizing the Si-based photocathodes in alkaline solutions is less than 100 h 25 . Increasing the thickness of the protective layer cannot solve the problem, as the carrier tunneling probabilities decay exponentially with the layer thickness.…”
Section: Introductionmentioning
confidence: 99%
“…[20] Reproducedw ith permissions. [18] TiO 2 with the conduction-band electron-transport mechanism was also applied to protect amorphous Si based photocathodes.J avey and colleagues deposited 80 nm of TiO 2 using reactive sputtering on top of 8nms puttered Ti layer to protect amorphous Si PEC cathodes with Ni-Mo catalytic layer and buried p-i-n junction (Ni-Mo cocatalyst and p-i-n junction will be discussed in Section 3.1.3 and 4.1, respectively). [19] Thet hin Ti layer was introduced to prevent the damage of amorphous Si during the TiO 2 sputtering process.T he resulting Si/Ti/TiO 2 /Ni-Mo electrode showed as table photocurrent of 11 mA cm À2 at 0V versus RHE (pH 4, AM1.5G), with less than 5% decay over 12 h. The amorphous Si photocathode without the TiO 2 protective layer decayed to 10 %ofits original photocurrent after 12 h.…”
Section: Ultrathin Tunneling Protective Layers For Hermentioning
confidence: 99%
“…Although they are rare and suffer from high cost, this group of metals may serve as archetypical catalysts to overcome the sluggish reaction kinetics,s ot hat other performance-determining factors can be identified and optimized, such as the effectiveness of the anti-corrosion layer (using Pt, [15,16] Ir, [18] and Ru [20] ), or the improvement of photovoltage from buried junctions (using Pt [11a] ). Although highly catalytically active, the high work function of Pt (5.7 eV) should be considered when contacting with p-type semiconductors, [13] as discussed in Section 4.3.…”
Section: Platinum-group Metals As Her Cocatalystsmentioning
confidence: 99%
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