Solubility and volume diffusion of nickel in tungsten at 1640°C

Muster, Walter J.; Yoon, Dur N.; Huppmann, W. J.

doi:10.1016/0022-5088(79)90111-5

Cited by 23 publications

(3 citation statements)

References 6 publications

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“…) [42]. The diffusion coefficient of Ni-W is much greater than that of the Fe-W (6 × 10 −15 m 2 s −1 for Ni-W [43], 10 −18 m 2 s −1 to 6 × 10 −19 m 2 s −1 for Fe-W [44]). Therefore, the diffusion of Ni into the solid-state W area is stronger than that of Fe.…”

Section: Eds Mapping Of the Materials Interfaces 421 Element Diffusio...mentioning

confidence: 95%

Abnormal interfacial bonding mechanisms of multi-material additive-manufactured tungsten–stainless steel sandwich structure

Wei

et al. 2022

Int. J. Extrem. Manuf.

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Tungsten (W) and stainless steel (SS) are well known for the high melting point and good corrosion resistance respectively. Bimetallic W-SS structures would offer potential applications in extreme environments. In this study, a SS→W→SS sandwich structure is fabricated via a special laser powder bed fusion (LPBF) method based on an ultrasonic-assisted powder deposition mechanism. Material characterization of the SS→W interface and W→SS interface was conducted, including microstructure, element distribution, phase distribution, and nano-hardness. A coupled modelling method, combining computational fluid dynamics modelling with discrete element method, simulated the melt pool dynamics and solidification at the material interfaces. The study shows that the interface bonding of SS→W (SS printed on W) is the combined effect of solid-state diffusion with different elemental diffusion rates and grain boundary diffusion. The keyhole mode of the melt pool at the W→SS (W printed on SS) interface makes the pre-printed SS layers repeatedly remelted, causing the liquid W to flow into the sub-surface of the pre-printed SS through the keyhole cavities realizing the bonding of the W→SS interface. The above interfacial bonding behaviours are significantly different from the previously reported bonding mechanism based on the melt pool convection during multiple material LPBF. The abnormal material interfacial bonding behaviours are reported for the first time.

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Section: Eds Mapping Of the Materials Interfaces 421 Element Diffusio...mentioning

confidence: 95%

Abnormal interfacial bonding mechanisms of multi-material additive-manufactured tungsten–stainless steel sandwich structure

Wei

et al. 2022

Int. J. Extrem. Manuf.

View full text Add to dashboard Cite

show abstract

“…As shown in Fig. 15(b), the microprobe analysis demonstrates that the shrinking grains consist of 100% W while the precipitated material is a W-O·15 wt% Ni solid solution [34]. This compositional difference provides a decrease in free energy of the order of lOOJmol-1 and overcompensates for the increase in interfacial energy produced by the liquid-solid area.…”

Section: Ostwald Ripening and Shape Accommodationmentioning

confidence: 95%

“…While the growing stage is understood to be a consequence of a single solution-reprecipitation process, L. Kozma [35] and W. J. Muster [34] have shown that nucleation, which controls the growth direction, is strongly influenced by several factors. The most important ones as well as typical driving forces are summarized in Table 2.…”

Section: Ostwald Ripening and Shape Accommodationmentioning

confidence: 99%