Solidification properties and microstructure investigation of the as-cast Sn-rich alloys of the Sn-Sb-Zn ternary system

Mladenović, Srba; Manasijević, Dragan; Maluckov, Biljana S.; Marković, Ivana; Marjanović, S.; Živković, Dragana

doi:10.4149/km_2016_3_211

Cited by 1 publication

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References 12 publications

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“…In another application, the Sn-5Sb alloy was used as a corrosion protection coating on a steel plate, as well as an electrically conductive area that could be used for subsequent grounding. 20 Additional improvements on the microstructure features and mechanical properties of the binary Sn-Sb alloys must require the addition of third alloying elements, such as In, 21 Cu, 22 Zn, 23 and Bi, [15][16][17] which are those most frequently employed.…”

Section: Introductionmentioning

confidence: 99%

Tailoring Morphology and Size of Microstructure and Tensile Properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) Solder Alloys

Dias

Costa

Soares

et al. 2017

Journal of Elec Materi

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Transient directional solidification experiments, and further optical and scanning electron microscopy analyses and tensile tests, allowed the dependence of tensile properties on the micromorphology and length scale of the dendritic/cellular matrix of ternary Sn-5.5Sb-1Ag and Sn-5.5Sb-1Cu alloys to be determined. Extensive ranges of cooling rates were obtained, which permitted specific values of cooling rate for each sample examined along the length of the casting to be attributed. Very broad microstructural length scales were revealed as well as the presence of either cells or dendrites for the Agcontaining alloy. Hereafter, microstructural spacing values such as the cellular spacing, k c , and the primary dendritic spacing, k 1 , may be correlated with thermal solidification parameters, that is, the cooling rate and the growth rate. While, for the Cu-containing Sn-Sb alloy, the b-Sn matrix is characterized only by the presence of dendritic arrangements, the Ag-containing Sn-Sb alloy is shown to have high-velocity b-Sn cells associated with high cooling rate regions, i.e., positions closer to the bottom of the alloy casting, with the remaining positions being characterized by a complex growth of b-Sn dendrites. Minor additions of Cu and Ag increase both the yield and ultimate tensile strengths when compared with the corresponding values of the binary Sn-5.5Sb alloy, with a small reduction in ductility. This has been attributed to the homogeneous distribution of the Ag 3 Sn and Cu 6 Sn 5 intermetallic particles related to smaller k 1 characterizing the dendritic zones of the ternary Sn-Sb-(Cu,Ag) alloys. In addition, the Ag-modified Sn-Sb alloy exhibited an initial wetting angle consistent with that characterizing the binary Sn-5.5Sb alloy.

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