Solidification process and microstructure evolution of bulk undercooled Co–Sn alloys

Liu, Li; Ma, Xinkai; Huang, Q.S.; Li, Jin-Fu; Cheng, Xinbin; Zhou, Yaohe

doi:10.1016/s1003-6326(13)62459-0

Cited by 11 publications

(2 citation statements)

References 14 publications

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“…Away from the surface as the line scan enters the CDZ then the concentration of Co dominates concentration of Cr. In accordance with SEM micrographs presented in Figures 2(b), 3 and 4 along with earlier findings (Dilawary et al, 2017b;Liu et al, 2013;Liu and Yao, 2012) CRZ is regarded as hyper-eutectic while the CDZ can be treated as hypo-eutectic structure. Surface hardness values for As PTA and LSMed hardfacings were determined as 612 6 17 HV 0.5 and 787 6 49 HV 0.5 , respectively.…”

Section: Resultssupporting

confidence: 90%

Nanotribological characteristics of laser surface melted Stellite 12+Mo hardfacing

Dilawary

Motallebzadeh

Afzal

et al. 2018

ILT

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Purpose The purpose of the study is to examine the sliding wear performance of plasma transfer arc (PTA) deposited and laser surface melted (LSM) Mo modified Stellite 12 hardfacings under high contact stresses (i.e. >20 GPa). Design/methodology/approach For this purpose, after structural characterization, sliding wear tests have been conducted using sphero-conical diamond indenter as the counterface with different normal loads. The wear tracks formed on the hardfacings were examined by atomic force microscopy and scanning electron microscopy. Findings Both hardfacings showed severe wear (at high contact stress levels ranging from 24 to 41 GPa), which progressed by plastic deformation, although the wear resistance of LSMed hardfacings was better than the PTA hardfacings by a factor of two due to its near surface microstructure characterized as carbide-rich zone. Originality/value Sliding wear characterization of a promising 10 Wt.% Mo modified version of commercial Stellite 12 hardfacings (as reported previously by authors) was done in as PTA and LSMed states using nanomechanical test system. To the best of authors’ knowledge, no report is available in the open literature on such hardfacings under these testing conditions.

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Section: Resultssupporting

confidence: 90%

Nanotribological characteristics of laser surface melted Stellite 12+Mo hardfacing

Dilawary

Motallebzadeh

Afzal

et al. 2018

ILT

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“…It has been found that Co additions are particularly effective at suppressing the nucleation undercooling of βSn [20][21][22][23][24][25][26][27][28][29]. Table 1 summarises 10 past studies on Co-microalloyed solders.…”

Section: The Paper Published In Journal Of Alloys and Compounds In 2016mentioning

confidence: 99%

Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5Cu solders

Belyakov

Gourlay

2016

Journal of Alloys and Compounds

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We show that cobalt-microalloying causes significant grain refinement in large samples (60g) of Sn-3Ag-0.5Cu solder. Nucleation occurs on the (100) facet of CoSn 3 crystals with a reproducible orientation relationship of (100) ∥ (100) withwhich has a planar lattice mismatch of ~4%. In 550m solder joints on Cu substrates, Co microalloying alters the Sn nucleation location to an CoSn 3 particle in the bulk liquid and increases the number of Sn nucleation events when the cooling rate is higher than ~5 K/s.However, Co-microalloying caused only weak grain refinement in sample volumes relevant to solder joints which is explained using nucleation and grain refinement theories.

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Recalescence Behavior, Solidification Characteristics and Microstructure Transformation of Rapidly Solidified Undercooled Cu-based Alloys

Wang

Tang

He³

et al. 2022

J. Wuhan Univ. Technol.-Mat. Sci. Edit.

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Solidification process and microstructure evolution of bulk undercooled Co–Sn alloys

Cited by 11 publications

References 14 publications

Nanotribological characteristics of laser surface melted Stellite 12+Mo hardfacing

Nanotribological characteristics of laser surface melted Stellite 12+Mo hardfacing

Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5Cu solders

Recalescence Behavior, Solidification Characteristics and Microstructure Transformation of Rapidly Solidified Undercooled Cu-based Alloys

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