Solid state diffusion bonding of titanium to steel using a copper base alloy as interlayer

Microstructural characterization of Cu/Al composites and effect of cooling rate at the Cu/Al interfacial region

“…Diffusion bonding is a process in which two materials are held together at a temperature below the melting point of the materials under a low pressure, which does not generate macroscopic plastic deformation in the materials [4,13]. In the present work, the diffusion bonding technique has been used to fabricate Cu/Al couples.…”

Characterization of diffusion-bonded titanium alloy and 304 stainless steel with Ag as an interlayer

“…Initially, the strength increased as the holding time was increased, but then it decreased after 90 min of holding time. This may be due to the quicker diffusion rate of pure titanium in contrast to copper [28]. The present study with silver as interlayer has yielded lap shear strength of 142 MPa at 800°C holding temperature, 5-MPa pressure, and 60 minutes of holding time.…”

Investigation on microstructure and mechanical properties of diffusion bonded Al/Mg2Si metal matrix composite using copper interlayer

“…It can be attributed to the existence of brittle CuAl 2 (Â) diffusion layer. In the diffusion bonding of titanium to steel using a copper base alloy, formation of narrow brittle diffusion layer adjacent to the base material on the steel side was reported by Elrefaey and Tillmann (2009).…”

“…Zhang et al (1999) used active alloy layer of Al-Si-Mg in diffusion bonding of Al/SiC MMCs and reported improved shear strength in comparison to non-interlayer diffusion bonding. Solid state diffusion bonding of titanium to steel using a copper base alloy as an interlayer at 850 • C for 30-180 min under the pressure of 3 MPa was investigated by Elrefaey and Tillmann (2009). They reported that the interface consisted of a continuous and homogenous reaction layer on both titanium and steel sides.…”