Solid-state bonding of A6061/high-tensile steel plate by metal salt generation bonding technique with acetic acid

Koyama, Satoshi; Ozawa, Kohei; Muraoka, Takako

doi:10.2464/jilm.69.548

Cited by 2 publications

(1 citation statement)

References 12 publications

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“…15) Furthermore, it was found that the bonding strength of A6061 aluminum alloy and high-strength steel sheet was greatly improved by applying an acetate film to the aluminum alloy side before solid phase bonding. 16) In recent years, nonelectrolyte NiP plating has come to be used on the copper wiring of print-wiring boards to control the formation of a brittle intermetallic compound layer at the interface between the solder and copper wiring. Nonelectrolyte NiP plating has attracted attention as an UBM (Under Bump Metallization) process because the rate of reaction with solder is slow, and numerous studies have been conducted on the bond interface and its mechanical properties in response to the operating environment (e.g., high temperature).…”

Section: Introductionmentioning

confidence: 99%

Low Temperature Solid-State Bonding of Nickel and Tin with Formic Acid Surface Modifications

2022

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The effect of formic acid surface modification process on the bond strength of the solid-state bonded interface of tin and nickel was investigated by SEM observations of fractured surfaces and interfacial microstructures. Tin and nickel surfaces were modified by boiling in formic acid for 600 s. Diffusion bonding was performed at bonding temperatures of 393493 K under a load of 7 MPa (bonding time for 1.8 ks). The bond strength increased with increasing bonding temperature irrespective of surface modification process. As a result of surface modification process, bonded joints were obtained at a bonding temperature 70 K lower than that required for non-modified surfaces used, and the bond strength was comparable to that of the base metal. When the surface modification process was not applied, the fracture mode was brittle. As the bond strength increased with increasing bonding temperature, the fracture mode changed to ductile. With surface modification process, this tendency was observed at a bonding temperature 70 K lower than without it. The results suggest that these changes in the fractured surface between tin and nickel were accompanied by expansion of the metal-to-metal contact area, which contributed to the increase in bond strength.

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Section: Introductionmentioning

confidence: 99%

Low Temperature Solid-State Bonding of Nickel and Tin with Formic Acid Surface Modifications

2022

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Solid State Bonding of Tin and Copper by Metal Salt Generation Bonding Technique Using Citric Acid

2022

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In the previous studies, the surface modification effect of formic acid on the bonding strength of tin and copper has been investigated. As a result of previous investigations, it was found that the lowering of the bonding temperature is achieved by removing the oxide film on the bonding surfaces with formic acid, forming a metal salt film, and thermally decomposing the film. However, it has been pointed out that formic acid is toxic and irritating and difficult to handle. Therefore, in this study, we decided to investigate the effects on the removal of the oxide film on the bonding surface and the bonding strength using citric acid, which is relatively harmless to the human body. In addition to observing the fractured surfaces and the bonded interfaces of the solid-state bonded tin and copper by SEM, thermal analysis of the compound produced by surface treatment with citric acid was carried out. The metal salt coating treatment using citric acid was carried out by boiling the bonding surfaces of tin and copper in citric acid for 300 s. Solid-state bonding was performed in a vacuum chamber under the following conditions; 383 473 K for bonding temperature, 7 MPa for bonding pressure and 1800 s for bonding time. Regardless of the metal salt coating treatment, the bond strength of the joint increased with the increase of the bonding temperature. When the metal salt coating treatment using citric acid was applied, the bonding temperature was reduced by 70 K to fabricate a joint with the base metal strength of tin. However, when the metal salt-coated surface was exposed to the atmosphere, the bonded surface was again covered with an oxide film and the bond strength decreased.

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Solid-state bonding of A6061/high-tensile steel plate by metal salt generation bonding technique with acetic acid

Cited by 2 publications

References 12 publications

Low Temperature Solid-State Bonding of Nickel and Tin with Formic Acid Surface Modifications

Low Temperature Solid-State Bonding of Nickel and Tin with Formic Acid Surface Modifications

Solid State Bonding of Tin and Copper by Metal Salt Generation Bonding Technique Using Citric Acid

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