Solderless Thermal Connector for Use at Low Temperatures

Boughton, Robert I.; Brubaker, N. R.; Sarwinski, R. J.

doi:10.1063/1.1721058

Cited by 34 publications

(2 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…First, this would provide further information on the applicability of the Wiedemann-Franz law for contacts at low temperature since there are conflicting results in the literature. On one side a discrepancy up to a factor of 2.5 has been reported [36] while discrepancies are much smaller for Gloos et al [16] see Table 1. This would also allow testing the effect of the indium filler far below its superconducting transition.…”

Section: Complementary Results and Discussionmentioning

confidence: 93%

Very low resistance Al/Cu joints for use at cryogenic temperatures

Triqueneaux,

Butterworth,

Goupy

et al. 2020

Preprint

View full text Add to dashboard Cite

We present two different techniques for achieving low resistance (<20 nΩ) contacts between copper and aluminium at cryogenic temperatures. The best method is based on gold plating of the surfaces in an e-beam evaporator immediately after Ar plasma etching in the same apparatus, yielding resistances as low as 3 nΩ that are stable over time. The second approach involves inserting indium in the Al/Cu joint. For both methods, we believe key elements are surface polishing, total removal of the aluminum oxide surface layer, and temporary application of large (typ. 11 kN) compression forces. We believe the values for gold plated contacts are the lowest ever reported for a Cu/Al joint of a few cm 2 . This technology could simplify the construction of thermal links for advanced cryogenics applications, in particular that of extremely low resistance heat switches for nuclear demagnetization refrigerators.

show abstract

Section: Complementary Results and Discussionmentioning

confidence: 93%

Very low resistance Al/Cu joints for use at cryogenic temperatures

Triqueneaux,

Butterworth,

Goupy

et al. 2020

Preprint

View full text Add to dashboard Cite

show abstract

“…Gold plating was employed to reduce the electrical contact resistance. 5,6 The test article was instrumented with Type E (chromelconstantan) thermocouples and with voltage taps. The voltage taps were Iocat_ 4 to provide data on both the joint and the base material performance.…”

Section: Measurement Detailsmentioning

confidence: 99%

Performance Evaluations of Demountable Electrical Connections

Niemann

Hull

et al. 1994

Advances in Cryogenic Engineering

View full text Add to dashboard Cite

This report was prepared as an account of work sponsored by an agency of the United States Government. Neither the United States Government nor any agency thereof, nor any of their employees, makes any warranty, express or implied, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any information, apparatus, product, or process disclosed, or represents that its use would not infringe privately owned rights. Reference herein to any specific commercial product, process,or service by trade name, trademark, manufacturer, or otherwise does not necessarily constitute or imply its endorsement, recommendation, or favoring by the United States Government or any agency thereof. The views and opinions of authors expressed herein do not necessarily state or reflect those of the United States Government or any agency thereof.

show abstract

Very-Low-Temperature Cooling Systems

Radebaugh

1983

Cryocoolers

View full text Add to dashboard Cite

Solderless Thermal Connector for Use at Low Temperatures

Cited by 34 publications

References 1 publication

Very low resistance Al/Cu joints for use at cryogenic temperatures

Very low resistance Al/Cu joints for use at cryogenic temperatures

Performance Evaluations of Demountable Electrical Connections

Very-Low-Temperature Cooling Systems

Contact Info

Product

Resources

About