Solderability of thin ENEPIG plating Layer for Fine Pitch Package application

Back, Jong-Hoon; Lee, Byung-Suk; Yoo, Sehoon; Han, Deok-Gon; Jung, Seung‐Boo; Yoon, Jeong‐Won

doi:10.6117/kmeps.2017.24.1.083

Cited by 9 publications

(5 citation statements)

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“…(11) The PVP solution was prepared by mixing PVP powder (Sigma-Aldrich, Mw~20,000) with propylene glycol monomethyl ether acetate (PGMEA, Sigma-Aldrich), and cross-linking agent (CLA) was added to the PVP solution with a ratio of 3:1 to improve the dielectric property. (12) The solution was stirred using a magnetic spin-bar for 24 hours. The spin coated PVP films were thermally cross-linked by two step annealing process.…”

Section: Methodsmentioning

confidence: 99%

Study on 6,13-bis(Triisopropylsilylethynyl) (TIPS) Pentacene Crystalline Morphology for Organic Thin Film Transistor

Han¹,

Bae²,

Chung³

2011

ECS Trans.

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We found that the crystallization of TIPS pentacene thin film plays an important role in determining the electrical property of organic thin film transistor (OTFT). OTFTs were fabricated using two different TIPS pentacenes, namely big grains and dendrite grains. Poly-4-vinylphenol (PVP) was used as a gate insulator, and Au electrode was evaporated using a shadow mask. The channel lengths of OTFTs with the bottom gate structure were 20-40 um.The mobility values of OTFTs fabricated with big grains reveal ten time higher values than those obtained from OTFTs fabricated with dendrite grains. The physical properties of the TIPS pentacene films were analyzed using optical microscope (OM), x-ray diffraction (XRD) and secondary electron microscopy (SEM). The electric characteristics of OTFT were obtained using Keithley-4200.OTFT utilizing ink jet print process has been attracted for the application such as bar code, low function flexible display, and electronic paper due to the advantage in the low end function electronics with low cost and easy fabrication. (1-2) There are various print processes such as Inkjet, Flexography, Gravure, Offset and Screen printing in printing process. Among them, inkjet-printing attracts much attention in device fabrication due to its many advantages including non-contact patterning, good local registration, low material waste thereby enabling to fabricate flexible and light-weight electronic products based on OTFT.The pentacene material should be chemically synthesized to be soluable in a certain solvent thereby enabling to print on the surface as a droplet. (3) The TIPS pentacene film would be formed by evaporating the solvent at the droplet surface. The degree of crystallization or crystalline morphology strongly depends on either the wettability of the solution on the surface or the evaporation rate at the droplet surface. The well coffeestain effect is arisen due to the evaporation difference between the peripheral edge and the center region. (4-6) Due to the aforementioned effect the mobility values reported from previous studies are below 0.01 cm 2 /Vs. (7-9) Such values are related with the crystallization through the carrier scattering phenomenon. The mobility value obtained from TIPS pentacene dissolved by the solvent having lower boiling point is about 0.00066 cm 2 /Vs, while that obtained from TIPS pentacene dissolved by the solvent having higher boiling point appears about 0.01 cm 2 /Vs. (10) According to the studies about the crystalline morphology with respect to the solvent, the TIPS pentacene films are typically composed with two different types of grains

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Section: Methodsmentioning

confidence: 99%

Study on 6,13-bis(Triisopropylsilylethynyl) (TIPS) Pentacene Crystalline Morphology for Organic Thin Film Transistor

Han¹,

Bae²,

Chung³

2011

ECS Trans.

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“…Since both the probe and MLC are Ni/Au plated, Ni 3 Sn and AuSn2 are formed following the interface regardless of the solder composition. Additionally, (Cu, Ni, Au) 6 Sn 5 and Cu 6 Sn 5 IMC were formed inside the solder, while Ag 3 Sn was formed when T7 SAC305 was used [13][14][15] . Fig.…”

Section: Analysis Of Joint Cross-section and Fracture Surfacementioning

confidence: 99%

Laser Soldering Process Optimization of MEMS Probe of Probe Card for Semiconductor Wafer Test

Hong

Kim

2022

J Weld Join

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In this study, the laser soldering process of probe-multilayer ceramic (MLC) substrates was optimized using Type 4 (T4) and Type 7 (T7) Sn-3.0Ag-0.5Cu (SAC305), T7 Sn-0.7Cu solders to improve the high-temperature durability of probe solder joints and satisfy the fine pitch requirements of the soldering process. Thermal cycle tests (TCTs) were performed to compare the heat resistance characteristics of the probe solder joint. The results showed that the bonding strength degradation rates of the SAC305 and Sn-0.7Cu solders after the TCT were within 40% compared to that of the as-soldered state. Because the probe surface and MLC were plated with Ni/Au, various intermetallic compounds (IMCs) were observed at the solder joint. The total IMC thickness of the T7 solder joint was thinner than that of the T4 solder because of the difference in redox reactions according to the particle size of the solder paste. The fracture surface of the probe-MLC solder joint after the shear strength test exhibited a mixed ductile and brittle fracture, and that of the Sn-0.7Cu solder joint exhibited a ductile fracture with numerous dimples.

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“…It can be seen that fillets were well formed in the probe solder joints, and various types of intermetallic compounds (IMC) were formed on the interface of probe solder joints. Regardless of the type, in the Pb-free solder joint of SAC305 and SAC0307, Ni IMCs were formed on the interface of probe solder joint, and on the solder base metal, Ag 3 Sn, Au x Sn y , Cu 6 Sn 5 , and (Cu,Ni,Au) 6 Sn 5 IMCs were formed [7][8][9][10][11][12][13][14][15] . Since the surface of the probe is plated with Ni/Au, various types of Au-Sn IMCs were observed inside the solder joint.…”

Section: Cross-sectional Analysis Of As-soldered Probe-mlc Jointmentioning

confidence: 99%

Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing

Kim

Hong

Yun³

et al. 2021

Journal of Welding and Joining

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In this study, the laser soldering process of microelectromechanical system (MEMS) probes and multilayer ceramic (MLC) substrates was optimized with Type 4 (T4) and Type 7 (T7) Sn-3.0Ag-0.5Cu (SAC305), Type 4 Sn-0.3Ag-0.7Cu (SAC0307), and Type 4 Sn-5.0Sb (SnSb) soldering, and the probe solder joint properties were compared. SAC0307 and SnSb were used to confirm the bonding property of the low-Ag solder and the high-temperature durability. We conducted a thermal cycling test (TCT) with 500 cycles at temperatures of -25 ℃ to 105 ℃ with a 10-min dwell time at each temperature. Before and after the TCT, the microstructure of solder joint as well as the shear strength between the probe and the MLC were examined. The results revealed that, after the TCT, the degradation rate of T7 SAC305 solder was lower than that of T4 SAC305, and the SnSb solder did not exhibit bonding strength degradation. The fracture mode of the SAC solder joint was ductile-brittle. In the case of the SnSb joint, brittle fracture was the major fracture mode because of the Sn-Sb intermetallic compounds. The SnSb solder had an excellent bonding strength and degradation property after the TCT, but the lack of toughness caused brittle fracture. These results confirm the applicability of T4 SnSb and T7 SAC305 solders for high-temperature response and fine pitch bonding.

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Solderability of thin ENEPIG plating Layer for Fine Pitch Package application

Cited by 9 publications

References 0 publications

Study on 6,13-bis(Triisopropylsilylethynyl) (TIPS) Pentacene Crystalline Morphology for Organic Thin Film Transistor

Study on 6,13-bis(Triisopropylsilylethynyl) (TIPS) Pentacene Crystalline Morphology for Organic Thin Film Transistor

Laser Soldering Process Optimization of MEMS Probe of Probe Card for Semiconductor Wafer Test

Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing

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