Solder spread: A criterion for evaluation of soldering

Humpston, G.; Jacobson, David M.

doi:10.1007/bf03214712

Cited by 10 publications

(3 citation statements)

References 8 publications

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“…Yet another method is the characterization of a material's tendency to spread the solder after application. The solder spread, also termed slump, can be used as a qualitative and quantitative evaluation of the solderability [22].…”

Section: Methodsmentioning

confidence: 99%

Laser-Induced Period Surface Structures to Improve Solderability of Electrical Solder Pads

Rung

Hellmann

2021

Applied Sciences

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We report on structuring copper representing soldering pads of printed circuit boards by laser-induced periodic surface structures. Femtosecond laser radiation is used to generate low spatial frequency laser-induced surface structures, having a spatial period of 992 nm and a modulation depth of 120 nm, respectively. The slump of screen-printed solder paste is measured to compare the solder coverage on the pads after the solder process on a hot plate. A comparative study of the coverage of solder paste on a fresh polished pad, a pad stored for two weeks, and femtosecond laser-structured pads reveals the improved wettability of structured pads even after storage. In addition, leaded and lead-free solder pads are compared with the particular advantages of the solder-free pad when periodically laser structured. Our findings are attributed to two major effects: namely, the increase of the surface area and the improved surface chemical wettability. Overall, the application of laser-induced periodic surface structures helps to reduce the demand of lead-based solder in the electronic industry and provides a feasible method for a fast and spatial selective way of surface functionalization.

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Section: Methodsmentioning

confidence: 99%

Laser-Induced Period Surface Structures to Improve Solderability of Electrical Solder Pads

Rung

Hellmann

2021

Applied Sciences

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“…2, in practice clean and solderable component surfaces can only be achieved if these are of gold. It should also be borne in mind that the solderable shelf life afforded by a gold coating will be a function of the roughness of the underlying surface, the method of application of the coating (its porosity) and its thickness (Humpston and Jacobson, 1990). Thus, a 0 .…”

Section: Protective Coating Applied To Parent Materialsmentioning

confidence: 99%

Fluxless soldering

Jacobson¹,

Humpston²

2006

International Materials Reviews

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Soldering without the use of liquid fluxes is frequently demanded for assembly of electronic, optical and mechanical components because these chemicals and their residues can adversely affect performance. Chemical fluxes operate by removing oxide films from metal surfaces, which otherwise impede the spreading and wetting that is so essential for successful soldering and joint formation. Fluxless soldering processes employ alternative strategies to achieve the same end. Typically the oxide films are removed by reduction, displacement or dissolution; alternatively they are simply prevented from forming in the first place by suitably modifying the surfaces of the joints. The range of conditions required for successful fluxless soldering and how these are being achieved are reviewed with reference to specific case studies described in the scientific and technical literature.

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“…However, it is not used as solder because of its ordinary spreading and wetting characteristic. Pure indium joints also possess inferior mechanical properties (Humpston and Jacobson, 1990). It creates an opportunity to develop such materials containing major volume of indium with addition of ductile, wettable materials such as Ag, Bi and Sn to increase its mechanical properties and which would remain ductile in an environment of À196°C and even after TC.…”

Section: Introductionmentioning

confidence: 99%

Study of mechanical properties of indium-based solder alloys for cryogenic applications

Deshpande

Chaudhari

Narayanan

et al. 2022

SSMT

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Purpose This study aims to develop indium-based solders for cryogenic applications. Design/methodology/approach This paper aims to investigate mechanical properties of indium-based solder formulations at room temperature (RT, 27 °C) as well as at cryogenic temperature (CT, −196 °C) and subsequently to find out their suitability for cryogenic applications. After developing these alloys, mechanical properties such as tensile and impact strength were measured as per American Society for Testing and Materials standards at RT and at CT. Charpy impact test results were used to find out ductile to brittle transition temperature (DBTT). These properties were also evaluated after thermal cycling (TC) to find out effect of thermal stress. Scanning electron microscope analysis was performed to understand fracture mechanism. Results indicate that amongst the solder alloys that have been studied in this work, In-34Bi solder alloy has the best all-round mechanical properties at RT, CT and after TC. Findings It can be concluded from the results of this work that In-34Bi solder alloy has best all-round mechanical properties at RT, CT and after TC and therefore is the most appropriate solder alloy amongst the alloys that have been studied in this work for cryogenic applications Originality/value DBTT of indium-based solder alloys has not been found out in the work done so far in this category. DBTT is necessary to decide safe working temperature range of the alloy. Also the effect of TC, which is one of the major reasons of failure, was not studied so far. These parameters are studied in this work.

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Solder spread: A criterion for evaluation of soldering

Abstract: Quantitative measurements of the intrinsic spread characteristics of solders used in electronics applications can be carried out by making use of the beneficial properties of gold.

Cited by 10 publications

References 8 publications

Laser-Induced Period Surface Structures to Improve Solderability of Electrical Solder Pads

Laser-Induced Period Surface Structures to Improve Solderability of Electrical Solder Pads

Fluxless soldering

Study of mechanical properties of indium-based solder alloys for cryogenic applications

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