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Cited by 7 publications
(1 citation statement)
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“…al. found that inadequate solder fillets results in a 250% difference in thermal cycling fatigue reliability [6]. The large temperature gradient due to the diode design can also generate excessive stress during the above-mentioned reliability test.…”
Section: Introductionmentioning
confidence: 99%
“…al. found that inadequate solder fillets results in a 250% difference in thermal cycling fatigue reliability [6]. The large temperature gradient due to the diode design can also generate excessive stress during the above-mentioned reliability test.…”
Section: Introductionmentioning
confidence: 99%
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