Solder Joint Reliability: An integrated study of Electromigration, Thermal Migration and thermo-mechanical effects

Forde, M.; Manning, Kevin; Kudtarkar, S.

doi:10.1109/iirw.2012.6468936

Cited by 2 publications

(1 citation statement)

References 8 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…A detailed understanding of the thermo-mechanical behaviour of lead-free solder interconnect is vital in improving operational reliability. Numerous experimental studies were carried out to evaluate solder joint reliability, as evident from studies carried out by Chen & Chen [22] and Forde et al [23].…”

Section: Introductionmentioning

confidence: 99%

Solder joint failures under thermo-mechanical loading conditions – A review

Depiver

Mallik

Harmanto

2020

Advances in Materials and Processing Technologies

View full text Add to dashboard Cite

Solder joints play a critical role in electronic devices by providing electrical, mechanical and thermal interconnections. These miniature joints are also the weakest links in an electronic device. Under severe thermal and mechanical loadings, solder joints could fail in 'tensile fracture' due to stress overloading, 'fatigue failure' because of the application of cyclical stress and 'creep failure' due to a permanent long-term load. This paper reviews the literature on solder joint failures under thermo-mechanical loading conditions, with a particular emphasis on fatigue and creep failures. Literature reviews mainly focused on commonly used lead-free Sn-Ag-Cu (SAC) solders. Based on literature in experimental and simulation studies on solder joints, it was found that fatigue failures are widely induced by accelerated thermal cycling (ATC). During ATC, the mismatch in coefficients of thermal expansion (CTE) between different elements of electronics assembly contributes significantly to induce thermal stresses on solder joints. The fatigue life of solder joints is predicted based on phenomenological fatigue models that utilise materials properties as inputs. A comparative study of 14 different fatigue life prediction models is presented with their relative advantages, scope and limitations. Creep failures in solder joints, on the other hand, are commonly induced through isothermal ageing. A critical review of various creep models is presented. Many of these strain ratebased creep models are routed to very well-known Anand Model of inelastic strain rate. Finally, the paper outlined the combined effect of creep and fatigue on solder joint failure.

show abstract

Section: Introductionmentioning

confidence: 99%