Solder joint inspection based on neural network combined with genetic algorithm

Detection and classification of Printed circuit board defects using image subtraction method

“…Solder joint inspection based on neural network combined with genetic algorithm had aslo been proposed [7] In subtraction based methods following are the basic steps: i) image acquisition has been done to acquire the digital image ii) image processing has been done to suppress the noise and other distortions from the image to be processed iii) image alignment has been done to align the true image and the test image. iv) image subtraction has been used to obtain the difference between the true and the test image.…”

Semantic Segmentation of a Printed Circuit Board for Component Recognition Based on Depth Images

“…Among them, a lot of studies [ 1 , 2 , 3 , 4 , 5 , 6 , 7 , 8 , 9 , 10 , 11 ] have focused on the inspection of solder joints, which is both important and challenging. Researchers have proposed a number of methods for solder joint inspection that use neural networks [ 1 , 2 ], fuzzy rules [ 3 ], Boolean rules [ 4 ], deep learning [ 5 ], support vector machines [ 6 ], decision trees [ 7 ], principle component analysis [ 8 ], modal analysis [ 9 ], etc. Component placement inspection is another significant and challenging problem, and it is the basis of other PCB inspections, such as the inspection of solder joints.…”

Unknown defect detection for printed circuit board based on multi‐scale deep similarity measure method

“…In the literature [9–11], due to the good learning ability, the researchers utilise ANN to detect solder joint defects in two ways, one is the supervised ANNs [10] and the other one is unsupervised method mentioned in [11]. Hao et al combine multilayer perceptron neural network with a genetic algorithm to do the solder joint defect detection on PCB [12]. Furthermore, some other detection and classification methods have attempted to detect PCB defects, which contain ANN ensembles used in [13], Bayes classifiers in [14] and SVM [15] for inspection of solder joints.…”