Solder joint failure modes, mechanisms, and life prediction models of IC packages under board level drop impact

Luan, Jing-en; Tee, Tong Yan; Zhang, Xueren; Hussab, E.

doi:10.1109/icept.2005.1564714

“…3~~~~~~~Tie(ls package side is greater than that on the PCB side. It is in good agreement with Luan's study [13]. Figure 7.…”

Section: Results Analysissupporting

confidence: 92%

“…Lead free solder is susceptible to brittle crack because of relatively higher elastic modulus, so stress criteria is suitable for investigating the drop impact reliability of lead free solder joint, which has been proven by Luan and Tee [13].The stress of solder balls is induced by PCB bending and mechanical shock during drop impact. Therefore, the PCB bending is the important indicator of solder joint performance.…”

Section: Results Analysismentioning

confidence: 98%

Simulating Analysis of Dynamic Responses for CSP under Board Level Drop Test

Pan

¹

,

Zhou

²

,

Yan

³

2006

2006 7th International Conference on Electronic Packaging Technology

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Exaggerated anticipatory anxiety is common in social anxiety disorder (SAD). Neuroimaging studies have revealed altered neural activity in response to social stimuli in SAD, but fewer studies have examined neural activity during anticipation of feared social stimuli in SAD. The current study examined the time course and magnitude of activity in threat processing brain regions during speech anticipation in socially anxious individuals and healthy controls (HC). Method Participants (SAD n = 58; HC n = 16) underwent functional magnetic resonance imaging (fMRI) during which they completed a 90s control anticipation task and 90s speech anticipation task.

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“…However, this approach is not entirely representative of the actual structure as it does not consider the IMC, which prevents the relative displacement difference at the solder-PCB and -chip contacts. Some studies [27,28] have attempted to model IMC in failure simulations, but they only use elastic properties, which cannot yield sufficiently accurate results. To account for the IMC, a clear understanding of its inelastic properties is necessary, but this information is difficult to find in the literature and may require additional experimentation.…”

Section: Fe Modelingmentioning

confidence: 99%

“…This work aims to investigate the evolution of the inelastic deformation path of solder joints under external force conditions through numerical simulations. The motivation for this research stems from the fact that many studies have discussed the occurrence of failure in solder joints when the maximum stress exceeds a critical value [27,28]. However, there has been little discussion on how the stress varies significantly during the occurrence of inelastic deformation due to the change in the deformation path.…”

Section: Introductionmentioning

confidence: 99%

Numerical Investigation of the Evolving Inelastic Deformation Path of a Solder Ball Joint under Various Loading Conditions

Lim

¹

,

Lee

²

,

Lee

³

2023

Applied Sciences

2

0

Get access via publisher Add to dashboard Cite

Exaggerated anticipatory anxiety is common in social anxiety disorder (SAD). Neuroimaging studies have revealed altered neural activity in response to social stimuli in SAD, but fewer studies have examined neural activity during anticipation of feared social stimuli in SAD. The current study examined the time course and magnitude of activity in threat processing brain regions during speech anticipation in socially anxious individuals and healthy controls (HC). Method Participants (SAD n = 58; HC n = 16) underwent functional magnetic resonance imaging (fMRI) during which they completed a 90s control anticipation task and 90s speech anticipation task.

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Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact

Liu

¹

,

Meng

²

,

Zhao

³

et al. 2009

Microelectronics Reliability

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Exaggerated anticipatory anxiety is common in social anxiety disorder (SAD). Neuroimaging studies have revealed altered neural activity in response to social stimuli in SAD, but fewer studies have examined neural activity during anticipation of feared social stimuli in SAD. The current study examined the time course and magnitude of activity in threat processing brain regions during speech anticipation in socially anxious individuals and healthy controls (HC). Method Participants (SAD n = 58; HC n = 16) underwent functional magnetic resonance imaging (fMRI) during which they completed a 90s control anticipation task and 90s speech anticipation task.

Solder joint failure modes, mechanisms, and life prediction models of IC packages under board level drop impact

Cited by 12 publications

References 6 publications

Simulating Analysis of Dynamic Responses for CSP under Board Level Drop Test

Simulating Analysis of Dynamic Responses for CSP under Board Level Drop Test

Numerical Investigation of the Evolving Inelastic Deformation Path of a Solder Ball Joint under Various Loading Conditions

Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact

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