Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact

Chou, Chan-Yen; Hung, Tuan‐Yu; Yang, Shan-Yi; Yew, Ming-Chih; Yang, Wenyu; Chiang, Kuo‐Ning

doi:10.1016/j.microrel.2008.06.024

Cited by 26 publications

(5 citation statements)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Finite element simulation is a feasible approach to reducing design cycles and time. Lin et al [ 1 ] built a finite element model for WLP. The reliability life can be obtained by substituting incremental equivalent plastic strain into the Coffin–Manson model, and simulation and experiment results are in good agreement.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Predicting Wafer-Level Package Reliability Life Using Mixed Supervised and Unsupervised Machine Learning Algorithms

Chiang

2022

Materials

Self Cite

View full text Add to dashboard Cite

With the increasing demand for electronic products, the electronic package gradually developed toward miniaturization and high density. The most significant advantage of the Wafer-Level Package (WLP) is that it can effectively reduce the volume and footprint area of the package. An important issue in the design of WLP is how to quickly and accurately predict the reliability life under the accelerated thermal cycling test (ATCT). If the simulation approach is not adopted, it usually takes several ACTCs to design a WLP, and each ACTC will take several months to get the reliability life results, which increases development time considerably. However, simulation results may differ depending on the designer’s domain knowledge, ability, and experience. This shortcoming can be overcome with artificial intelligence (AI). In this study, finite element analysis (FEA) is combined with machine learning algorithms, e.g., Kernel Ridge Regression (KRR), to create an AI model for predicting the reliability life of electronic packaging. Kernel Ridge Regression (KRR) combined with the K-means cluster algorithm provides a highly accurate and efficient way to obtain AI models for large-scale data sets.

show abstract

Section: Introductionmentioning

confidence: 99%

“…Because the element mesh size in the upper right corner of the solder ball is crucial to the final simulation result, Cheng [ 2 ] built a 3D finite element model for an area array type package. In this study, we will build our simulation database for machine learning by following our lab modeling experiences [ 1 , 2 , 3 , 4 ].…”

Section: Introductionmentioning

confidence: 99%

Predicting Wafer-Level Package Reliability Life Using Mixed Supervised and Unsupervised Machine Learning Algorithms

Chiang

2022

Materials

Self Cite

View full text Add to dashboard Cite

show abstract

“…Failure of solder due to drop and impact of the components has emerged to be an important issue to the industry in recent years (see, e.g., [1][2][3][4][5][6][7][8][9][10][11][12][13]). This is different from the traditional thermomechanical fatigue problem, since the loading rate involved in drop and impact can be several orders of magnitude higher than that during thermal cycling.…”

Section: Introductionmentioning

confidence: 99%

Numerical study of ductile failure morphology in solder joints under fast loading conditions

Shen

Aluru

2010

Microelectronics Reliability

View full text Add to dashboard Cite

“…The rapid developments of handheld and portable electronic devices have posed a significant challenge for the mechanical and electrical functions of the microscale solder interconnects in the devices subjected to dropping, vibration and impact, or thermal-electromigration; the loss of the functions in the interconnects, which have already shown to exert one of the strongest influences on reliability of electronic equipments and systems [1], often results in product failures. In above cases, generally the crack nucleation, propagation and coalescence are most likely to occur in various interfaces in joints [2,3].…”

Section: Introductionmentioning

confidence: 99%

“…In above cases, generally the crack nucleation, propagation and coalescence are most likely to occur in various interfaces in joints [2,3]. In spite of the sufficient dynamic mechanics researches in solder joints and electronic products [1][2][3], there are still limited studies detailing the dynamic fracture behavior at the interface between the solder and intermetallic compound (IMC) or at the interface between the solder and Cu, which are two of the most common interfaces in the solder interconnects.…”

Section: Introductionmentioning

confidence: 99%

Finite element simulation of interfacial fracture and impact behavior at the interfaces of microscale Sn-Ag-Cu solder interconnects

Zhang

2010

2010 11th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

View full text Add to dashboard Cite

Thus far, there is a severe lack of understanding about interfacial fracture and impact behavior of the microscale lead-free solder interconnects. In this study, the finite element simulation and analytical method were used to characterize the interfacial fracture and impact behavior at the interfaces of the microscale Sn-Ag-Cu solder joints. The intersection of a linear microcrack tip upon Sn-Ag-Cu solder/IMC interface was studied and the results reveal that the microcrack tends to debond rather than penetrate the interface with the impinging angle in the range of 20 to 90°, due to the fact that the solder provides 3 times more fracture energy than IMC to the crack propagation. Furthermore, in the interfacial impact between Cu and Sn-Ag-Cu solder, the maximum Von Mises stresses in Cu are obvious larger than that in Sn-Ag-Cu solder when the initial velocity is from 100 to 200 m/s. However, an inverse trend occurs, that is, the maximum Von Mises stresses in SnAg-Cu becomes larger when the velocity increases from 500 to 1000 m/s. In addition, the simulation results show that rupture occurs more easily along Sn-Ag-Cu/Cu interface than along impact (or shock compression) direction when time is prolonging, owing to the effect of large shear stress caused by the effect of Poisson contraction of the visco-plastic Sn-Ag-Cu solder.

show abstract

Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact

Cited by 26 publications

References 9 publications

Predicting Wafer-Level Package Reliability Life Using Mixed Supervised and Unsupervised Machine Learning Algorithms

Predicting Wafer-Level Package Reliability Life Using Mixed Supervised and Unsupervised Machine Learning Algorithms

Numerical study of ductile failure morphology in solder joints under fast loading conditions

Finite element simulation of interfacial fracture and impact behavior at the interfaces of microscale Sn-Ag-Cu solder interconnects

Contact Info

Product

Resources

About