Solder fatigue failures in a new designed power module under Power Cycling

Fotuhi‐Firuzabad

et al. 2020

Sci Rep

The quantity and variety of parameters involved in the failure evolutions in solder joints under a thermo-mechanical process directs the reliability assessment of electronic devices to be frustratingly slow and expensive. To tackle this challenge, we develop a novel machine learning framework for reliability assessment of solder joints in electronic systems; we propose a correlation-driven neural network model that predicts the useful lifetime based on the materials properties, device configuration, and thermal cycling variations. The results indicate a high accuracy of the prediction model in the shortest possible time. A case study will evaluate the role of solder material and the joint thickness on the reliability of electronic devices; we will illustrate that the thermal cycling variations strongly determine the type of damage evolution, i.e., the creep or fatigue, during the operation. We will also demonstrate how an optimal selection of the solder thickness balances the damage types and considerably improves the useful lifetime. The established framework will set the stage for further exploration of electronic materials processing and offer a potential roadmap for new developments of such materials.

Section: Proposed Methodologymentioning

confidence: 99%

Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics

Fotuhi‐Firuzabad

et al. 2020

Sci Rep

IET Electric Power Appl

“…Insulated gate bipolar transistors (IGBTs) and metal oxide semiconductor field effect transistors (MOSFETs) are widely applied in the power inverter [1]. Semiconductor chip failure [2], bond wire lift-offs [3,4] and solder ageing [5,6] are the major failure modes of power module, which could directly affect the reliability and lifetime of the power inverter. These failure modes are usually caused by thermal stress, which is due to an excessive junction temperature or/and severe temperature fluctuation occurred in vulnerable locations during power cycling of chips [7,8].…”

Section: Introductionmentioning

confidence: 99%

A dual fuzzy logic controller‐based active thermal control strategy of SiC power inverter for electric vehicles

Wang

Song

et al. 2021

Thermal stress is one of the most important factors leading to power module failure. Under the load condition of high current with low fundamental frequency or largely changed load current, it would cause high junction temperature swing amplitude (JTSA) of chips, which could accelerate the failure of power module. To address this issue, this paper proposes a dual fuzzy logic controller‐based active thermal control (ATC) strategy to reduce the JTSA of chips in cases of variable power profiles. Two fuzzy logic controllers are designed to reduce the JTSA of chips by adjusting the switching frequency and pulse width modulation (PWM) strategy, respectively. One fuzzy logic controller is designed to reduce the transient JTSA of chips, which is done by changing the switching frequency according to the fundamental frequency and transient JTSA. The other one is to reduce the mean JTSA of chips, which is implemented by regulating the switching frequency and PWM modes according to the mean junction temperature and its variation. The minimum one is selected as the switching frequency of power inverter. Finally, the effectiveness of the proposed ATC strategy is verified by simulation and experimental results.

“…However, there are three major challenges which restrict the application of soldering in the assembly of high power modules. The first one is the low creep resistance of the solder joints in high-temperature environment (Durand et al , 2016). The high service temperature of high power modules is a threat to the reliability of the solder joints.…”

Section: Introductionmentioning

confidence: 99%

Stress analysis of pressure-assisted sintering for the double-side assembly of power module

Liu

Zhang

Wang

et al. 2019

SSMT

Purpose: Crack and stress distribution on dies are the key issues for the pressure-assisted sintering bonding of power modules. The aim of this research is to build the relationship among the stress distributions, the sintering sequences, and the sintering pressures during the sintering processes. Design/methodology/approach: Three sintering sequences, S(a), S(b) and S(c), have been designed for the double-side assembly of power module in this paper. Experiments and finite element method (FEM) analysis are conducted to investigate the crack and stress distribution. Findings: The sintering sequence had significant effects on the crack generation in the chips during the sintering process under 30 MPa pressure. The simulation results revealed that the module sintered by S(a) showed lower chip stress than those by the other two sintering sequences under 30 MPa. In contrast, the chip stress is the highest when the sintering sequence follows S(b). The simulation results explained the crack generation and prolongation in the experiments. S(a) was recommended as the best sintering sequence because of the lowest chip stress and highest yield rate. Originality/value: This study investigated the stress distributions of the double-side sintered power modules under different sintering pressures. Based on the results of experiments and finite element method (FEM) analysis, the best sintering sequence design is provided under various sintering pressures.