Solder Fatigue Analyses and Predictions for PCB Mounted Components after Thirteen Years of Thermal Field Cycling

Dudek, Rainer; Döring, Ralf; Kreyßig, Kerstin; Rzepka, Sven; Fruehauf, Peter; Weigert, Andreas

doi:10.1109/eurosime60745.2024.10491474

2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and 2024

DOI: 10.1109/eurosime60745.2024.10491474

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Solder Fatigue Analyses and Predictions for PCB Mounted Components after Thirteen Years of Thermal Field Cycling

Rainer Dudek,

Ralf Döring,

Kerstin Kreyßig

et al.

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Solder Fatigue Analyses and Predictions for PCB Mounted Components after Thirteen Years of Thermal Field Cycling

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References 13 publications

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