Solder bumping methods for flip chip packaging

Micro-optics fabrication by mask-based and mask-less mixed lithography process towards 3D optical circuits

“…The substrate containing the such as a ridge wave guide will be fabricated via mask based techniques. A light source such as a VCSEL can be fabricated on a separate plane chip bonding [2,3]. On the region of the chip which requires coupling there of photoresist.…”

“…To achieve integration in multiple dimensions, an efficient coupling of light between active and passive optics are required. For example, a surface grating structure [2], or alternatively we proposed a 45 degree surface micro mirror can be fabricated by gray-scale laser direct writing in a fully CMOS compatible manner and is used in conjunction with vertical cavity surface emitting lasers (VCSEL), although, a grating based coupler may be limited by its design spectral bandwidth.…”

Concept for an Alternative Solder-Free Flip-Chip Technique on SOI using Black-Silicon

“…In the past, several flip-chip studies focusing on solder bump deposition or varying solder compositions have been published [1]. A critical point is how to deposit a relatively large amount of an alloy with a low melting point and good reflow properties.…”

A Busbar Like Power Module Based On 3D Chip On Chip Hybrid Integration

“…-nano copper wires interconnection [9] -metal post interconnection [7] -solder bump interconnection [10] -dimple array interconnection [7] -power overlay technology embedded power [2].…”