2020
DOI: 10.1016/j.infsof.2020.106293
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Software product line applied to the internet of things: A systematic literature review

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Cited by 20 publications
(8 citation statements)
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References 32 publications
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“…Where in SPLE, the member of product line harvests new software products using existing artefacts as core reference by configuring software components in high quality, short time and less cost [23]. For further knowledge on SPLE, we can read from this article [24]. The advantage of reusability method in SPLE has also been implemented in IoT development [25], [26].…”
Section: Dynamic Software Product Line Engineeringmentioning
confidence: 99%
“…Where in SPLE, the member of product line harvests new software products using existing artefacts as core reference by configuring software components in high quality, short time and less cost [23]. For further knowledge on SPLE, we can read from this article [24]. The advantage of reusability method in SPLE has also been implemented in IoT development [25], [26].…”
Section: Dynamic Software Product Line Engineeringmentioning
confidence: 99%
“…Indeed, there are several works that use a SPL approach to model cyber-physical systems, as we comment below. In most of approaches, variability is managed by FMs [25]. Traditionally, SPLs use single layer FMs [26], in which only application features are contemplated and not the variability of the infrastructure.…”
Section: Related Workmentioning
confidence: 99%
“…Esse projeto garante o controle da plantação a longa distância, via ponto de conexão com uma rede wireless, ou servidor local. As etapas de projeto do FarmBot consistem tanto na estrutura de montagem mecânica, como no framework da IoT, seguindo as camadas estabelecidas por (Geraldi et al, 2020): (i) dispositivos eletrônicos, como microprocessador, sensores e atuadores; (ii) nuvem, responsável pela interface de processamento e armazenamento de dados relacionados à camada de interface; e (iii) interface de usuário, que contém uma aplicação remota que se conecta aos dispositivos eletrônicos. Essas camadas, somadas a etapa de montagem estrutural, formam os estágios desse projeto, apresentados na O estágio 1 consiste na impressão das peças, montagem e modelagem da estrutura física e ferramentas que compõe o projeto.…”
Section: Descrição Do Sistemaunclassified