Soft fabric-based flexible organic light-emitting diodes

Kim, Woohyun; Kwon, Seonil; Lee, Sung Min; Kim, Jin Yeong; Han, Yuncheol; Kim, Eungtaek; Choi, Kyung Cheol; Park, Sungmee; Park, Byoung-Cheul

doi:10.1016/j.orgel.2013.09.001

Cited by 94 publications

(71 citation statements)

References 25 publications

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“…Because wearable and flexible electronics have been a focus of research for various applications, flexible OLEDs (f-OLEDs) have also gained considerable attention [10][11][12]. Successful fabrication of stretchable and bendable OLEDs on polymer substrates has been demonstrated by the present authors and others [1,13,14].…”

Section: Introductionmentioning

confidence: 69%

The effects of compressive stress on the performance of organic light-emitting diodes

Zhou

Park

2015

Organic Electronics

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Section: Introductionmentioning

confidence: 69%

The effects of compressive stress on the performance of organic light-emitting diodes

Zhou

Park

2015

Organic Electronics

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“…The flexible substrates usually are plastic platforms such as PET, polyimide (PI), polyethylene naphthalate (PEN) and polycarbonate (PC). Other flexible substrates include textile [51,52], silk [53,54], paper [55][56][57][58], metalfoil [59,60], shape-memory polymer [61][62][63] and so on. Besides, weavable and fiber-like electrode [17,64]/device configurations [65][66][67][68][69], or even substrate-free free-standing configurations [70] are also demonstrated as effective ways for obtaining flexible devices.…”

Section: Flexible Device Configurationsmentioning

confidence: 99%

“…Besides these thin-film electrodes, fiber-/mesh-shaped electrodes also demonstrated good flexibility [17,51,64,67,68].…”

Section: Design Of Flexible Electrodesmentioning

confidence: 99%

Thin-film organic semiconductor devices: from flexibility to ultraflexibility

Qian

Zhang

et al. 2016

Sci. China Mater.

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Flexible thin-film organic semiconductor devices have received wide attention due to favorable properties such as light-weight, flexibility, reproducible semiconductor resources, easy tuning of functional properties via molecular tailoring, and low cost large-area solution-procession. Among them, ultraflexible electronics, usually with minimum bending radius of less than 1 mm, are essential for the development of epidermal and bio-implanted electronics, wearable electronics, collapsible and portable electronics, three dimensional (3D) surface compliable electronics, and bionics. This review firstly gives a brief introduction of development from flexible to ultraflexible organic semiconductor electronics, and design of ultraflexible devices, then summarizes the recent advances in ultraflexible thin-film organic semiconductor devices, focusing on organic field effect transistors, organic light-emitting diodes, organic solar cells and organic memory devices.

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“…The multibarrier structure is simple, attractive, and effective in terms of barrier and flexibility properties. The multibarrier encapsulation of flexible and wearable OLEDs has shown a reasonable lifetime, comparable to that achieved with glass-lid-type encapsulation [5,6]. In recent years, several researchers studied the TFE of OLEDs by alternating inorganic materials such as Al 2 O 3 and MgO deposited via atomic layer deposition (ALD) and the superior organic layer through the evolution of the deposition technique and solution synthesis [7][8][9].…”

Section: Introductionmentioning

confidence: 99%

Metal-containing thin-film encapsulation with flexibility and heat transfer

Kwon

Kim

et al. 2015

Journal of Information Display

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The thin-film encapsulation (TFE) technology is a salient technique for the realization of flexible organic light-emitting diodes. To reliably fabricate bendable and lightweight displays, ultra-thin and flexible encapsulation is required. Reported herein is a moisture-resistant, flexible, and thermally conductive TFE technology created by inserting a metal thin film with an inorganic-organic multibarrier structure to resolve the reliability and heat dissipation issues. Silica-nanoparticleembedded sol-gel organic/inorganic hybrid nanocomposite (S-H) and Al 2 O 3 were used as organic and inorganic materials, respectively. A silver (Ag) thin film used as a metal was deposited through thermal evaporation, and it had slight barrier properties, outstanding ductility, and high thermal conductivity. The proposed structure, which consists of three materials, resulted in a low water vapor transmission rate of 10 −5 g/m 2 /day for a 240-nm-thick thin film, and showed improvement of the resistance to bending stress compared with the previous structure formed without an Ag thin film in terms of flexibility. A comparative analysis of the heat transfer properties of encapsulation structures was also performed through the investigation of the thermal conductivity of the materials, and thermal imaging measurement. The heat dissipation performance was confirmed to have been improved by the insertion of Ag thin films into the inorganic/organic multibarrier.

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Soft fabric-based flexible organic light-emitting diodes

Cited by 94 publications

References 25 publications

The effects of compressive stress on the performance of organic light-emitting diodes

The effects of compressive stress on the performance of organic light-emitting diodes

Thin-film organic semiconductor devices: from flexibility to ultraflexibility

Metal-containing thin-film encapsulation with flexibility and heat transfer

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