2018 IEEE International Electron Devices Meeting (IEDM) 2018
DOI: 10.1109/iedm.2018.8614496
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SoC Logic Compatible Multi-Bit FeMFET Weight Cell for Neuromorphic Applications

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Cited by 103 publications
(51 citation statements)
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“…Table 2 shows a comparative study between FeFET-based analog synapse and various other candidates like PCM (Burr et al, 2010;Athmanathan et al, 2016;Ambrogio et al, 2018) and RRAM (Lee et al, 2012;Wu et al, 2017;Wu W. et al, 2018;Luo et al, 2019). One major benefit of using FeFET for implementing analog synapse is the reduced variability to less that 0.5% (Luo et al, 2019) and an order of magnitude reduction in write energy (Dünkel et al, 2018;Ni et al, 2019b). The cell area is comparable to that of PCM and RRAM.…”
Section: Discussionmentioning
confidence: 99%
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“…Table 2 shows a comparative study between FeFET-based analog synapse and various other candidates like PCM (Burr et al, 2010;Athmanathan et al, 2016;Ambrogio et al, 2018) and RRAM (Lee et al, 2012;Wu et al, 2017;Wu W. et al, 2018;Luo et al, 2019). One major benefit of using FeFET for implementing analog synapse is the reduced variability to less that 0.5% (Luo et al, 2019) and an order of magnitude reduction in write energy (Dünkel et al, 2018;Ni et al, 2019b). The cell area is comparable to that of PCM and RRAM.…”
Section: Discussionmentioning
confidence: 99%
“…The FeFET-based analog synapse is realized using voltage-dependent partial polarization switching in multi-domain ferroelectric thin film ( Jerry et al, 2018a , b ). Recent experimental works have shown the ability to program FeFETs with voltage pulse widths as low as 50 ns ( Jerry et al, 2018b ) while the programming voltage can be brought down from 4 to 1.8 V by engineering the gate stack by adding an additional metal layer between the ferroelectric capacitor and MOS capacitor ( Ni et al, 2019b ). Table 2 shows a comparative study between FeFET-based analog synapse and various other candidates like PCM ( Burr et al, 2010 ; Athmanathan et al, 2016 ; Ambrogio et al, 2018 ) and RRAM ( Lee et al, 2012 ; Wu et al, 2017 ; Wu W. et al, 2018 ; Luo et al, 2019 ).…”
Section: Discussionmentioning
confidence: 99%
“…Recently, programming voltage as low as 1.8 V has been experimentally demonstrated for FeFET by engineering the device structure and by adding a middle metal layer between the ferroelectric capacitor and MOS capacitor [25]. Therefore, I/O transistors at the 32-nm node can be applied to support the 1.8-V programming voltage.…”
Section: Prospect Of Scalingmentioning
confidence: 99%
“…The growth of epitaxial thin films allowed the demonstration of ferroelectric memristors [1], however, integrating such films on CMOS remains challenging and expensive, requiring flip-chip or wafer bonding techniques. The discovery of ferroelectricity in hafnium oxide enabled the demonstration of ferroelectric memristors in the Front-and Back-End-Of-Line (BEOL) [2], [3] through techniques allowing crystallization in the ferroelectric phase with a low thermal budget [4]. Ferroelectric Tunnel Junctions (FTJs) possess only two terminals and are a desirable approach for crossbar array fabrication.…”
Section: Introductionmentioning
confidence: 99%