2019
DOI: 10.1039/c8qi00982a
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Sn(TFSI)2as a suitable salt for the electrodeposition of nanostructured Cu6Sn5–Sn composites obtained on a Cu electrode in an ionic liquid

Abstract: Sn nanostructured thin films prepared by electrodeposition in an ionic liquid directly on a Cu substrate provided high performance as Li-ion negative electrodes.

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Cited by 4 publications
(4 citation statements)
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“…The scan was performed at 0.05 V s À 1 starting from the open circuit potential (E OCP ) toward cathodic and reversed anodic sides. Concerning the solution of Sn 2 + , we observed a cathodic peak at À 0.17 V vs. Sn 2 + /Sn previously assigned to the reduction of Sn 2 + to Sn 0 and a reoxydation occurring at + 0.10 V. [7] In the case of a 25 mM Cu (TFSI) 2 in [EMIm + ][TFSI À ], the voltammograms stabilized after several cycles ( Figure S4) indicating that side reactions occurred. Thereafter, the CV showed a reduction peak at À 0.02 V vs. Sn 2 + /Sn, followed by an oxidation occurring at + 0.53 V. Such a cathodic peak value cannot be assigned based on standard potential due to the contribution of the solvation energy of copper ions in [EMIm + ][TFSI À ] solvent.…”
Section: Resultsmentioning
confidence: 63%
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“…The scan was performed at 0.05 V s À 1 starting from the open circuit potential (E OCP ) toward cathodic and reversed anodic sides. Concerning the solution of Sn 2 + , we observed a cathodic peak at À 0.17 V vs. Sn 2 + /Sn previously assigned to the reduction of Sn 2 + to Sn 0 and a reoxydation occurring at + 0.10 V. [7] In the case of a 25 mM Cu (TFSI) 2 in [EMIm + ][TFSI À ], the voltammograms stabilized after several cycles ( Figure S4) indicating that side reactions occurred. Thereafter, the CV showed a reduction peak at À 0.02 V vs. Sn 2 + /Sn, followed by an oxidation occurring at + 0.53 V. Such a cathodic peak value cannot be assigned based on standard potential due to the contribution of the solvation energy of copper ions in [EMIm + ][TFSI À ] solvent.…”
Section: Resultsmentioning
confidence: 63%
“…Concerning the solution of Sn 2+ , we observed a cathodic peak at −0.17 V vs . Sn 2+ /Sn previously assigned to the reduction of Sn 2+ to Sn 0 and a re‐oxydation occurring at +0.10 V . In the case of a 25 mM Cu(TFSI) 2 in [EMIm + ][TFSI − ], the voltammograms stabilized after several cycles (Figure S4) indicating that side reactions occurred.…”
Section: Resultsmentioning
confidence: 79%
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“…Aqueous electrolytes commonly used for tin growth are acidic or alkaline. Non-aqueous electrolytes can be ionic liquids that have studied commonly last decade [11]. Tin is electrodeposited from Sn 2+ electrolyte by applying direct current.…”
Section: Introductionmentioning
confidence: 99%